Die zerstörungsfreie Ermittlung von Eigenspannungen mittels Härtemessung an der Oberfläche von metallischen Bauteilen/ Non-destructive determination of residual stresses by hardness measurement at the surface of metallic structural parts/ Determination non destructive des contraintes internes par mesure de la durete a la surface de corps me&talliques

1964 ◽  
Vol 6 (1) ◽  
pp. 6-10
Author(s):  
Georg Oppel
Keyword(s):  
Residual Stresses ◽  
Hardness Measurement ◽  
Structural Parts ◽  
Non Destructive

Texture and Strain Experiments at OPAL

2010 ◽  
Vol 638-642 ◽  
pp. 2823-2828 ◽  
Author(s):  
Ulf Garbe ◽  
Oliver Kirstein ◽  
Andrew Studer ◽  
Vladimir Luzin ◽  
Klaus Dieter Liss
Keyword(s):  
Residual Stresses ◽  
New Technologies ◽  
Physical And Mechanical Properties ◽  
Local Variation ◽  
Inhomogeneous Deformation ◽  
New Materials ◽  
Destructive Analysis ◽  
Properties Of Materials ◽  
Non Destructive

In response to the development of new materials and the application of materials and components in new technologies the direct measurement, calculation and evaluation of textures and residual stresses has gained worldwide significance in recent years. Non-destructive analysis for phase specific residual stresses and textures is only possible by means of diffraction methods. The determination of global texture and the local variation of texture for example by inhomogeneous deformation are very important due to the coherence between the texture and the physical and mechanical properties of materials.

Non-destructive determination of residual stresses in welded components using neutron diffraction

1998 ◽  
Vol 12 (9) ◽  
pp. 698-703 ◽  
Author(s):  
G Albertini ◽  
G Bruno ◽  
P Calbucci ◽  
F Fiori ◽  
M Rogante ◽  
...  
Keyword(s):  
Neutron Diffraction ◽  
Residual Stresses ◽  
Non Destructive

scholarly journals Application of Local Current Pulses for Determination and Control of Residual Stresses

2014 ◽  
Vol 996 ◽  
pp. 386-391 ◽  
Author(s):  
Leonid Lobanov ◽  
Vyacheslav Pivtorak ◽  
Nikolay Paschin ◽  
Viktor Savitsky ◽  
Galina Tkachuk
Keyword(s):  
Residual Stresses ◽  
Speckle Interferometry ◽  
Electrode System ◽  
Practical Application ◽  
Local Current ◽  
Pulsed Electric Current ◽  
Aircraft Engineering ◽  
And Control ◽  
Non Destructive

An electrode system for inducing a high density pulsed electric current (PEC) into the material for residual stresses (RS) relaxation has been proposed. A new non-destructive technology for determination of RS using electron speckle interferometry in combination with a local PEC treatment has been developed. Application of PEC at increased power parameters was investigated for control of stressed state of welded structures used in aircraft engineering. Results of practical application of the developed technologies and equipment are presented.

Residual Stresses Gradient Determination in Cu Thin Films

2006 ◽  
Vol 524-525 ◽  
pp. 595-600 ◽  
Author(s):  
Jun Peng ◽  
Vincent Ji ◽  
Jian Min Zhang ◽  
Wilfrid Seiler
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Residual Stresses ◽  
Penetration Depth ◽  
Stress Gradient ◽  
Family Plan ◽  
New Development ◽  
Destructive Measurement ◽  
Non Destructive

The non-destructive analysis by GIXRD allows us to determine the residual stress distribution as a function of XRD penetration depth and film thickness. A new development on the determination of residual stresses distribution is presented here. The procedure, based on the GIXRD geometry (referred to here as the ‘sin2ψ*’), enables non-destructive measurement of stresses gradient with only one diffraction family plan at a chosen depth taking into account the correction of measured direction. The chosen penetration depth is well defined for different combination of ψ and Φ and needs not to be changed during experimentation. This method was applied for measurement of residual stress gradient in Cu thin films. The obtained residual stress levels and their distribution were quite comparable with those determined by another multi-reflection method.

Stoichiometric Determination of Graphite Intercalation Compounds Using Rutherford Backscatiering Spectrometry

1983 ◽  
Vol 27 ◽  
Author(s):  
L. Salamanca-Riba ◽  
B.S. Elman ◽  
M.S. Dresselhaus ◽  
T. Venkatesan
Keyword(s):  
Experimental Error ◽  
Rutherford Backscattering Spectrometry ◽  
Rutherford Backscattering ◽  
Intercalation Compounds ◽  
Graphite Intercalation Compounds ◽  
X Ray ◽  
Donor And Acceptor ◽  
Graphite Intercalation ◽  
Non Destructive

ABSTRACTRutherford backscattering spectrometry (RBS) is used to characterize the stoichiometry of graphite intercalation compounds (GIC). Specific application is made to several stages of different donor and acceptor compounds and to commensurate and incommensurate intercalants. A deviation from the theoretical stoichiometry is measured for most of the compounds using this non-destructive method. Within experimental error, the RBS results agree with those obtained from analysis of the (00ℓ) x-ray diffractograms and weight uptake measurements on the same samples.

DETERMINATION OF RESIDUAL STRESSES AND STRESS INTENSITY FACTORS BY REMOVING LOCAL MATERIAL

2017 ◽  
Vol 48 (4) ◽  
pp. 377-398
Author(s):  
Svyatoslav Igorevich Eleonskii ◽  
Igor Nikolaevich Odintsev ◽  
Vladimir Sergeevich Pisarev ◽  
Stanislav Mikhailovich Usov
Keyword(s):  
Stress Intensity ◽  
Residual Stresses ◽  
Stress Intensity Factors ◽  
Intensity Factors ◽  
Local Material

Application of EDS Technique for OSP Film Thickness Measurement

2006 ◽  
Author(s):  
Prong Kongsubto ◽  
Sirarat Kongwudthiti
Keyword(s):  
Thin Film ◽  
Quantitative Analysis ◽  
Joint Strength ◽  
Critical Factor ◽  
Thickness Measurement ◽  
Ic Manufacturing ◽  
And Control ◽  
Film Thickness Measurement ◽  
Non Destructive

Abstract Organic solderability preservatives (OSPs) pad is one of the pad finishing technologies where Cu pad is coated with a thin film of an organic material to protect Cu from oxidation during storage and many processes in IC manufacturing. Thickness of OSP film is a critical factor that we have to consider and control in order to achieve desirable joint strength. Until now, no non-destructive technique has been proposed to measure OSP thickness on substrate. This paper reports about the development of EDS technique for estimating OSP thickness, starting with determination of the EDS parameter followed by establishing the correlation between C/Cu ratio and OSP thickness and, finally, evaluating the accuracy of the EDS technique for OSP thickness measurement. EDS quantitative analysis was proved that it can be utilized for OSP thickness estimation.

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