Application of EDS Technique for OSP Film Thickness Measurement

2006 ◽  
Author(s):  
Prong Kongsubto ◽  
Sirarat Kongwudthiti
Keyword(s):  
Thin Film ◽  
Quantitative Analysis ◽  
Joint Strength ◽  
Critical Factor ◽  
Thickness Measurement ◽  
Ic Manufacturing ◽  
And Control ◽  
Film Thickness Measurement ◽  
Non Destructive

Abstract Organic solderability preservatives (OSPs) pad is one of the pad finishing technologies where Cu pad is coated with a thin film of an organic material to protect Cu from oxidation during storage and many processes in IC manufacturing. Thickness of OSP film is a critical factor that we have to consider and control in order to achieve desirable joint strength. Until now, no non-destructive technique has been proposed to measure OSP thickness on substrate. This paper reports about the development of EDS technique for estimating OSP thickness, starting with determination of the EDS parameter followed by establishing the correlation between C/Cu ratio and OSP thickness and, finally, evaluating the accuracy of the EDS technique for OSP thickness measurement. EDS quantitative analysis was proved that it can be utilized for OSP thickness estimation.

Characterization and Control of Copper CMP with Optoacoustic Metrology

2001 ◽  
Vol 671 ◽  
Author(s):  
Michael Gostein ◽  
Paul Lefevre ◽  
Alex A. Maznev ◽  
Michael Joffe
Keyword(s):  
Film Thickness ◽  
Spatial Resolution ◽  
Chemical Mechanical Polishing ◽  
High Spatial Resolution ◽  
Mechanical Polishing ◽  
Length Measurement ◽  
And Control ◽  
Non Destructive

ABSTRACTWe discuss applications of optoacoustic film thickness metrology for characterization of copper chemical-mechanical polishing (CMP). We highlight areas where the use of optoacoustics for CMP characterization provides data complementary to that obtained by other techniques because of its ability to directly measure film thickness with high spatial resolution in a rapid, non-destructive manner. Examples considered include determination of planarization length, measurement of film thickness at intermediate stages of polish, and measurement of arrays of metal lines.

Standardisation of X-Ray Powder Diffraction Methods

2004 ◽  
Vol 443-444 ◽  
pp. 31-34
Author(s):  
Giovanni Berti ◽  
Rob Delhez ◽  
S. Norval ◽  
B. Peplinski ◽  
E. Tolle ◽  
...  
Keyword(s):  
Technical Committee ◽  
Non Destructive Testing ◽  
X Ray Diffraction ◽  
Destructive Testing ◽  
X Ray ◽  
Standard Documents ◽  
And Control ◽  
Non Destructive ◽  
Research Centres

This paper outlines the standardisation process for the XRPD method that is currently being considered by a Working Group (WG10) of Technical Committee 138 "Non-destructive Testing" of the European Committee for Standardisation CEN. Several Standard Documents are on the verge of being released. These documents concern the general principles of (X-ray) diffraction, its terminology, and the basic procedures applied. Another document concerns the instruments used and it offers procedures to characterise and control the performance of an X-ray diffractometer properly. It is intended to issue Standard Documents on specific methods, e.g. determination of residual stresses. In fact work is in progress on this subject. The Standard Documents can be used by industry, government organisations, and research centres with activities related to safety, health and the environment, as well as for educational purposes.

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