Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts

2020 ◽  
Author(s):  
2014 ◽  
Vol 137 (1) ◽  
Author(s):  
Matthew Ernst ◽  
Ed Habtour ◽  
Abhijit Dasgupta ◽  
Michael Pohland ◽  
Mark Robeson ◽  
...  

Multiaxial and uniaxial vibration experiments were conducted in order to study the differences in failure modes and fatigue life for the two types of excitation. An electrodynamic (ED) shaker capable of controlled vibration in six degrees of freedom (DOF) was employed for the experiments. The test specimen consisted of six large inductors insertion mounted on a printed wiring board (PWB). Average damage accumulation rate (DAR) in the inductor leads was measured for random excitations in-plane, out-of-plane, and both directions simultaneously. Under simultaneous multiaxial excitation, the average DAR was found to be 2.2 times greater than the sum of the in-plane and out-of-plane DARs. The conclusion was that multiple-step sequential uniaxial testing may significantly overestimate the durability of large/heavy structures with high center of mass in a multiaxial dynamic environment. Additionally, a test method utilizing uniaxial vibration along a direction other than the principal directions of the structure was examined. This method was found to have significant limitations, but showed better agreement with simultaneous multiaxial vibration experiments.


MRS Bulletin ◽  
2006 ◽  
Vol 31 (6) ◽  
pp. 471-475 ◽  
Author(s):  
Marc Chason ◽  
Daniel R. Gamota ◽  
Paul W. Brazis ◽  
Krishna Kalyanasundaram ◽  
Jie Zhang ◽  
...  

AbstractDevelopments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems.The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.


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