2012 IEEE 62nd Electronic Components and Technology Conference
Latest Publications

TOTAL DOCUMENTS

354

(FIVE YEARS 0)

H-INDEX

20

(FIVE YEARS 0)

Published By IEEE

9781467319652, 9781467319669, 9781467319645

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermocompression bonding of Ag-MWCNTs nanocomposite films as an alternative die-attach solution for high temperature packaging of SiC devices

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6248833 ◽

2012 ◽

Author(s):

Vanessa Smet ◽

Mamun Jamal ◽

Alan Mathewson ◽

Kafil M. Razeeb

Keyword(s):

High Temperature ◽

Nanocomposite Films ◽

Thermocompression Bonding

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Low slow-wave effect and crosstalk for low-cost ABF-coated TSVs in 3-D IC interposer

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6249103 ◽

2012 ◽

Author(s):

Yu-Jen Chang ◽

Tai-Yu Zheng ◽

Hao-Hsiang Chuang ◽

Chuen-De Wang ◽

Peng-Shu Chen ◽

...

Keyword(s):

Slow Wave ◽

Low Cost ◽

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Characterization of a novel fluxless surface preparation process for die interconnect bonding

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6248801 ◽

2012 ◽

Author(s):

Eric F. Schulte ◽

Keith A. Cooper ◽

Matthew Phillips ◽

Subhash L. Shinde

Keyword(s):

Surface Preparation ◽

Preparation Process

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A novel wafer-level metal/BCB interconnection between both sides of wafer using TSV and its microwave performance

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6249135 ◽

2012 ◽

Author(s):

Jiajie Tang ◽

Xiao Chen ◽

Gaowei Xu ◽

Le Luo

Keyword(s):

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Decoupling optimization for IC-package and PCB systems considering high performance microprocessor core and signal interface interactions

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6249082 ◽

2012 ◽

Author(s):

Om P. Mandhana

Keyword(s):

High Performance ◽

Signal Interface ◽

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Synthesis and characterization of nanoscaled solder material

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6248914 ◽

2012 ◽

Author(s):

Andrej Novikov ◽

Mathias Nowottnick

Keyword(s):

Synthesis And Characterization ◽

Solder Material

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NCF for pre-applied process in higher density electronic package including 3D-package

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6248859 ◽

2012 ◽

Author(s):

Kazutaka Honda ◽

Akira Nagai ◽

Makoto Satou ◽

Shinsuke Hagiwara ◽

Satoru Tuchida ◽

...

Keyword(s):

Electronic Package ◽

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Non-causal behavior: The cause for concern

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6249095 ◽

2012 ◽

Author(s):

Wesley Martin ◽

Jerry Bartley ◽

Matt Doyle ◽

Richard Ericson ◽

George Zettles

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Design, modeling, and fabrication of mm3 three-dimensional integrated antennas

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6249081 ◽

2012 ◽

Author(s):

Peter Gadfort ◽

Paul D. Franzon

Keyword(s):

Three Dimensional ◽

Integrated Antennas

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Robust TSV via-middle and via-reveal process integration accomplished through characterization and management of sources of variation

2012 IEEE 62nd Electronic Components and Technology Conference ◽

10.1109/ectc.2012.6248922 ◽

2012 ◽

Author(s):

Niranjan Kumar ◽

Sesh Ramaswami ◽

John Dukovic ◽

Jennifer Tseng ◽

Ran Ding ◽

...

Keyword(s):

Process Integration ◽

Sources Of Variation

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