Influence of Temperature on the Low Cycle Fatigue of Surface Mounted Chip Carrier/Printed Wiring Board Joints

1987 ◽  
Author(s):  
H. D. Solomon
Keyword(s):  
Low Cycle Fatigue ◽  
Cycle Fatigue ◽  
Printed Wiring Board ◽  
Influence Of Temperature ◽  
Influence Of Temperature On ◽  
Chip Carrier ◽  
Wiring Board

Influence of Temperature on the Fatigue of CC/PWB Joints

1990 ◽  
Vol 33 (1) ◽  
pp. 17-25
Author(s):  
Harvey Solomon
Keyword(s):  
Fatigue Life ◽  
Low Cycle Fatigue ◽  
Hysteresis Loops ◽  
Cycle Fatigue ◽  
Printed Wiring Board ◽  
Influence Of Temperature ◽  
Joint Resistance ◽  
Influence Of Temperature On ◽  
Chip Carrier ◽  
Wiring Board

This is a study of the low cycle fatigue of chip carrier/ printed wiring board joints tested at -55° C (-67° F) and 125° C (257° F). It is contrasted to a previous study where the joints were tested at 35° C (95° F). The behavior at 35° C and 125° C was the same. Differences were noted, however, at -55° C. The hysteresis loops were distorted. The slopes of the displacement vs. fatigue life curves were slightly lower and the fatigue lives were longer. These differences were especially significant when the change in joint resistance was used to define failure.

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