The Effect of Mixed-Mode Loading on Delamination Fracture Toughness

2009 ◽  
pp. 291-291-12
Author(s):  
P Sriram ◽  
Y Khourchid ◽  
SJ Hooper
Keyword(s):  
Fracture Toughness ◽  
Mixed Mode ◽  
Mixed Mode Loading ◽  
Delamination Fracture

Delamination fracture toughness of woven-fabric composites under mixed-mode loading

AIAA Journal ◽  
1999 ◽  
Vol 37 ◽  
pp. 517-520
Author(s):  
Nurudeen B. Adeyemi ◽  
Kunigal N. Shivakumar ◽  
Vishnu S. Avva
Keyword(s):  
Fracture Toughness ◽  
Mixed Mode ◽  
Woven Fabric ◽  
Mixed Mode Loading ◽  
Woven Fabric Composites ◽  
Delamination Fracture ◽  
Fabric Composites

Delamination Fracture Toughness of Woven-Fabric Composites Under Mixed-Mode Loading

AIAA Journal ◽  
10.2514/2.747 ◽  
1999 ◽  
Vol 37 (4) ◽  
pp. 517-520 ◽  
Author(s):  
Nurudeen B. Adeyemi ◽  
Kunigal N. Shivakumar ◽  
Vishnu S. Avva
Keyword(s):  
Fracture Toughness ◽  
Mixed Mode ◽  
Woven Fabric ◽  
Mixed Mode Loading ◽  
Woven Fabric Composites ◽  
Delamination Fracture ◽  
Fabric Composites

Measurements of the Adhesion Strength of Cu/Epoxy Interfaces

1999 ◽  
Vol 586 ◽  
Author(s):  
H. Y. Lee ◽  
Jin Yu
Keyword(s):  
Fracture Toughness ◽  
Mixed Mode ◽  
Loading Condition ◽  
Double Cantilever Beam ◽  
Mixed Mode Loading ◽  
Interfacial Fracture Toughness ◽  
Brazil Nut ◽  
Molding Compound ◽  
Failure Path ◽  
In The Beginning

ABSTRACTCopper-based leadframe sheets were oxidized in a black-oxide forming solution, molded with epoxy molding compound (EMC), and the interfacial fracture toughness was measured using sandwiched double cantilever beam (SDCB) and sandwiched Brazil-nut (SBN) specimens.Results showed that pebble-like Cu2O precipitates on the leadframe had almost no adhesion to EMC while the opposite was true of the acicular CuO precipitates. Thus, the fracture toughness of the leadframe/EMC interface was close to zero in the beginning but rapidly increased to ˜100 J/m2 as acicular CuO nucleated on the smooth-faceted Cu2O layer. Under the mixed Mode loading the fracture toughness increased parabolically with the phase angle (ψ) with minimum at ψ = 0°. For ψ < -340, interface crack kinked into EMC. Fractography analyses based on XRD, SEM and AES studies showed that the failure path along the leadframe/EMC interface varied significantly with the loading condition and the crack speed.

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