Three-Dimensional Microstructural Characterization Using Focused Ion Beam Tomography

MRS Bulletin ◽  
2007 ◽  
Vol 32 (5) ◽  
pp. 408-416 ◽  
Author(s):  
Michael D. Uchic ◽  
Lorenz Holzer ◽  
Beverley J. Inkson ◽  
Edward L. Principe ◽  
Paul Munroe

AbstractThis article reviews recent developments and applications of focused ion beam (FIB) microscopes for three-dimensional (3D) materials characterization at the microscale through destructive serial sectioning experiments. Precise ion milling—in combination with electron-optic—based imaging and surface analysis methods—can be used to iteratively section through metals, ceramics, polymers, and electronic or biological materials to reveal the true size, shape, and distribution of microstructural features. Importantly, FIB tomographic experiments cover a critical size-scale gap that cannot be obtained with other instrumentation. The experiments encompass material volumes that are typically larger than 1000 μm3, with voxel dimensions approaching tens of nanometers, and can contain structural, chemical, and crystallographic information. This article describes the current state of the art of this experimental methodology and provides examples of specific applications to 3D materials characterization.

Author(s):  
Thomas M. Moore

Abstract The availability of the focused ion beam (FIB) microscope with its excellent imaging resolution, depth of focus and ion milling capability has made it an appealing platform for materials characterization at the sub-micron, or "nano" level. This article focuses on nanomechanical characterization in the FIB, which is an extension of the FIB capabilities into the realm of nano-technology. It presents examples that demonstrate the power and flexibility of nanomechanical testing in the FIB or scanning electron microscope with a probe shaft that includes a built-in strain gauge. Loads that range from grams to micrograms are achievable. Calibration is limited only by the availability of calibrated load cells in the smallest load ranges. Deflections in the range of a few nanometers range can be accurately applied. Simultaneous electrical, mechanical, and visual data can be combined to provide a revealing study of physical behavior of complex and dynamic nanostructures.


2014 ◽  
Vol 61 (1) ◽  
pp. 109-120 ◽  
Author(s):  
J. A. Taillon ◽  
C. Pellegrinelli ◽  
Y. Huang ◽  
E. D. Wachsman ◽  
L. G. Salamanca-Riba

2011 ◽  
Vol 17 (2) ◽  
pp. 240-245 ◽  
Author(s):  
N. Payraudeau ◽  
D. McGrouther ◽  
K.U. O'Kelly

AbstractIn this study, we present a fully automated method to investigate and reconstruct the three-dimensional crack structure beneath an indent in a highly insulating material. This work concentrates on issues arising from a long automatic acquisition process, the insulating nature of the specimen, and the introduction of minimal damage to the original cracks resulting from indentation.


Sign in / Sign up

Export Citation Format

Share Document