Sample Preparation of Aluminum Bridge Test Vehicles for Tem In-Situ Crystallographic Studies of Electromigration
Keyword(s):
IntroductionElectromigration in aluminum films has been identified as an increasing concern for integrated circuit reliability. Electromigration is the mass transport of atoms in a conductor under a current stress. Electromigration occurs in conductors experiencing current densities greater than 105 A/cm2 and is accelerated by high temperature. The damage to aluminum films manifests itself in the formation of voids, hillocks and whiskers along the conductor. This paper presents a test vehicle preparation procedure which can be used to investigate electromigration.
1986 ◽
Vol 44
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pp. 740-741
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2014 ◽
Vol 4
(1)
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pp. N3113-N3117
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2013 ◽
pp. 151-180
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1992 ◽
Vol 41
(3)
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pp. 458-465
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