Effects of Sputtered Particle Energy on the Properties of SiO2 Films

1988 ◽  
Vol 128 ◽  
Author(s):  
Yasunori Taga ◽  
Takeshi Ohwaki

ABSTRACTThe secondary ion energy distributions (SIED) emitted from Si under various conditions of targets (Si, SiO2) and primary ions (Ar+, O+) were measured and the thin SiO2 films were deposited by magnetron sputtering techniques under the corresponding conditions to the SIED experiments. The most probable energies of silicon oxygen cluster ions of SimOn+ (m, n=l, 2,…) are equal to those of Al+ thermal ions, while those of Siℓ+ (ℓ=l, 2,…) remain unchanged with the introduction of oxygen in chamber during Ar+ ion bombardment. The currentvoltage plots of SiO2 films are also measured and found to be influenced by the deposition conditions.It is concluded that the differences in current-voltage characteristics of SiO2 films prepared under various sputtering conditions can be reasonably explained in terms of the changes in the most probable energy of the sputtered particles.

1991 ◽  
Vol 235 ◽  
Author(s):  
Ying Wu ◽  
W. Savin ◽  
T. Fink ◽  
N. M. Ravindra ◽  
R. T. Lareau ◽  
...  

ABSTRACTExperimental analysis and simulation of the formation and electrical characterization of TiSi2/+/p-Si shallow junctions are presented here. The formation of shallow n+-p junction, by ion implantation of As through Ti films evaporated on p-Si substrates followed by Rapid Thermal Annealing (RTA) and conventional furnace annealing has been performed in these experiments. Structural techniques such as Secondary Ion Mass Spec-troscopy (SIMS) and Rutherford Backscattering (RBS) experiments have been employed to characterize these devices. RUMP simulations were used to analyze and interpret the RBS data. Current-voltage characteristics have been simulated using PISCES simulator.


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