Non-Destructive Assessment Of Semiconductor Carrier Lifetime Using Photothermal Radiometry

1996 ◽  
Vol 428 ◽  
Author(s):  
S. Amirhaghi ◽  
A. J. Kenyon ◽  
M. Federighi ◽  
C. W. Pitt

AbstractOf crucial importance to all areas of the microelectronics industry is the characterisation of silicon wafer quality. An important indicator of this is carrier lifetime, and a convenient non-destructive method for its measurement is Pholothermal Radiometry. This involves the photo-generation within a semiconductor sample of electron-hole pairs. Periodic generation of carriers leads to modulation of free-carrier absorption of mid-ir radiation provided by a black body source. The fr-radiation detected from the photo-excited region is inversely proportional to the optically induced carrier density. As the modulation frequency is increased, a point is reached at which the photo-generated carriers no longer have sufficient time to decay between pulses. This frequency is dependent on the carrier lifetime. We present a description of the Photothermal Radiometric lifetime scanning instrument built at UCL. This instrument offers an accurate method for producing detailed maps of carrier lifetime across whole or part wafers. The problem of surface-state effects has been addressed by employing a broad-band uv source to optically fill the surface states of the sample under investigation. The instrument is capable of producing maps of lifetime variation with 0.5 mm resolution. Alternatively, for selected points on a wafer, the instrument can generate detailed frequercy scans of free-carrier absorption. From these, it is possible to obtain information on surface recombination velocity and diffusion length.

2011 ◽  
Vol 679-680 ◽  
pp. 205-208 ◽  
Author(s):  
Jawad ul Hassan ◽  
Patrik Ščajev ◽  
Kęstutis Jarašiūnas ◽  
Peder Bergman

Free carrier dynamics has been studied in 4H- and 3C-SiC in a wide temperature range using time-resolved photoluminescence, free carrier absorption, and light induced transient grating techniques. Considerably high carrier lifetime was observed in 3C-SiC epitaxial layers grown on 4H-SiC substrates using hot-wall CVD with respect to previously reported values for 3C-SiC grown either on Si or on 6H-SiC substrates. The temperature dependences of carrier lifetime and diffusion coefficient for 4H- and 3C-SiC were compared. Shorter photoluminescence decay time with respect to free carrier absorption decay time was observed in the same 4H-SiC sample, while these techniques revealed similar trends in the carrier lifetime temperature dependencies. However, the latter dependences for hot-wall CVD-grown 3C layers were found different if measured by time resolved photoluminescence and free carrier absorption techniques.


2013 ◽  
Vol 740-742 ◽  
pp. 465-468 ◽  
Author(s):  
Sethu Saveda Suvanam ◽  
M. Usman ◽  
K. Gulbinas ◽  
V. Grivickas ◽  
Anders Hallén

This paper aims to establish a new method to characterize the interface between 4H-SiC and passivating dielectric layers. The investigations are made on MOS test structures utilizing Al2O3and SiO2dielectrics on 4H-SiC. These devices are then exposed to various fluences of Ar+implantation and then measured by the new method utilizing optical free carrier absorption (FCA) technique to assess the interface traps. A program has been developed using MATLAB to extract surface recombination velocity (SRV) at the oxide/epi-layer interface from the optical data. Capacitance-voltage (CV) is done to extract the density of interface traps (Dit) and a comparison was made. It is observed that SiO2samples show a large rise of SRVs, from 0.5×104cm/s for a reference sample to 8×104cm/s for a fluence of 1×1012cm-2, whereas Al2O3samples show more stable SRV, changing from 3×104cm/s for the un-irradiated reference sample to 6×104cm/s for a fluence of 1×1012cm-2. A very similar trend is observed for Ditvalues extracted from CV measurements and it can therefore be concluded that the FCA method is a suitable technique for the interface characterization.


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