Plastic Deformation and Recrystallization Studied by the 3-D x-ray Microscope

1999 ◽  
Vol 590 ◽  
Author(s):  
D. Juul Jensen ◽  
Å. Kvick ◽  
E.M. Lauridsen ◽  
U. Lienert ◽  
L. Margulies ◽  
...  

ABSTRACTA newly developed synchrotron instrument – the so-called 3D X-ray microscope – is presented. The instrument is placed at the Materials Science beamline at ESRF and dedicated to local μm scale structural characterization within bulk materials. In this paper, emphasis is on in situ studies of thermomechanical processing. The potential of the instrument for characterization of single nuclei and grains is described and discussed based on both first results and planned experiments.

Author(s):  
Shabana Noor ◽  
Richard Goddard ◽  
Fehmeeda Khatoon ◽  
Sarvendra Kumar ◽  
Rüdiger W. Seidel

AbstractSynthesis and structural characterization of two heterodinuclear ZnII-LnIII complexes with the formula [ZnLn(HL)(µ-OAc)(NO3)2(H2O)x(MeOH)1-x]NO3 · n H2O · n MeOH [Ln = Pr (1), Nd (2)] and the crystal and molecular structure of [ZnNd(HL)(µ-OAc)(NO3)2(H2O)] [ZnNd(HL)(OAc)(NO3)2(H2O)](NO3)2 · n H2O · n MeOH (3) are reported. The asymmetrical compartmental ligand (E)-2-(1-(2-((2-hydroxy-3-methoxybenzylidene)amino)-ethyl)imidazolidin-2-yl)-6-methoxyphenol (H2L) is formed from N1,N3-bis(3-methoxysalicylidene)diethylenetriamine (H2valdien) through intramolecular aminal formation, resulting in a peripheral imidazoline ring. The structures of 1–3 were revealed by X-ray crystallography. The smaller ZnII ion occupies the inner N2O2 compartment of the ligand, whereas the larger and more oxophilic LnIII ions are found in the outer O2O2’ site. Graphic Abstract Synthesis and structural characterization of two heterodinuclear ZnII-LnIII complexes (Ln = Pr, Nd) bearing an asymmetrical compartmental ligand formed in situ from N1,N3-bis(3-methoxysalicylidene)diethylenetriamine (H2valdien) through intramolecular aminal formation are reported.


2012 ◽  
Vol 544 ◽  
pp. 34-38 ◽  
Author(s):  
T. Hosokai ◽  
A. Hinderhofer ◽  
A. Vorobiev ◽  
C. Lorch ◽  
T. Watanabe ◽  
...  

1990 ◽  
Vol 112 (12) ◽  
pp. 4821-4830 ◽  
Author(s):  
David R. Corbin ◽  
L. Abrams ◽  
G. A. Jones ◽  
M. M. Eddy ◽  
W. T. A. Harrison ◽  
...  

2002 ◽  
Vol 738 ◽  
Author(s):  
R.I. Barabash ◽  
G.E. Ice ◽  
N. Tamura ◽  
J.R. Patel ◽  
B.C. Valek ◽  
...  

ABSTRACTElectromigration during accelerated testing can induce early stage plastic deformation in Al interconnect lines as recently revealed by the white beam scanning X-ray microdiffraction. In the present paper, we provide a first quantitative analysis of the dislocation structure generated in individual micron-sized Al grains during anin-situelectromigration experiment. Laue reflections from individual interconnect grains show pronounced streaking after electric current flow. We demonstrate that the evolution of the dislocation structure during electromigration is highly inhomogeneous and results in the formation of unpaired randomly distributed dislocations as well as geometrically necessary dislocation boundaries. Approximately half of all unpaired dislocations are grouped within the walls. The misorientation created by each boundary and density of unpaired individual dislocations is determined.


ChemInform ◽  
1990 ◽  
Vol 21 (38) ◽  
Author(s):  
D. R. CORBIN ◽  
L. ABRAMS ◽  
G. A. JONES ◽  
M. M. EDDY ◽  
W. T. A. HARRISON ◽  
...  

2003 ◽  
Vol 766 ◽  
Author(s):  
R.I. Barabash ◽  
N. Tamura ◽  
B.C. Valek ◽  
R. Spolenak ◽  
J.C. Bravman ◽  
...  

AbstractNew synchrotron x-ray microbeam methodology is used to analyze and test the reliability of interconnects. The early stage of plastic deformation induced by electromigration before any damages become visible has been recently revealed by white beam scanning X-ray microdiffraction during an accelerated test on Al interconnect lines. In the present paper, we provide a quantitative analysis of the dislocation structure generated in several micron-sized Al grains in both the middle region and ends of the interconnect line during anin-situelectromigration experiment. We demonstrate that the evolution of the dislocation structure during electromigration is highly inhomogeneous and results in the formation of randomly distributed geometrically necessary dislocations as well as geometrically necessary boundaries. The orientation of the activated slip systems and rotation axis depends on the position of the grain in the interconnect line. The origin of the observed plastic deformation is considered in view of constraints for dislocation arrangements under applied electric field during electromigration. The coupling between plastic deformation and precipitation in the Al (0.5% wt. Cu) is observed for the grains close to the anode/cathode end of the line.


1994 ◽  
Vol 39 (16) ◽  
pp. 2415-2418 ◽  
Author(s):  
P.G. Allen ◽  
S.D. Conradson ◽  
M.S. Wilson ◽  
S. Gottesfeld ◽  
I.D. Raistrick ◽  
...  

ChemInform ◽  
2010 ◽  
Vol 27 (51) ◽  
pp. no-no
Author(s):  
T. M. NENOFF ◽  
J. B. PARISE ◽  
G. A. JONES ◽  
L. G. GALYA ◽  
D. R. CORBIN ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document