Investigation of the thermal conductivity of the pentatellurides (Hf1-XZrXTe5) using the parallel thermal conductance technique.

2000 ◽  
Vol 626 ◽  
Author(s):  
B. M. Zawilski ◽  
R. T. Littleton ◽  
Terry M. Tritt ◽  
D. R. Ketchum ◽  
J. W. Kolis
Keyword(s):  
Thermal Conductivity ◽  
Low Temperature ◽  
Radiation Effects ◽  
Thermal Conductance ◽  
Small Samples ◽  
Formidable Challenge ◽  
Conductance Technique ◽  
Small Needle ◽  
A New Technique ◽  
Future Work

ABSTRACTThe pentatelluride materials (Hf1-XZrXTe5) have recently garnered much interest as a potential low temperature thermoelectric material. Their power factor exceeds that of the current Bi2Te3 materials over the temperature range 150 K < T < 350 K. A formidable challenge has been the capability of measuring the thermal conductivity of small needle-like samples (2.0 × 0.05 × 0.1 mm3) such as pentatellurides (HfXZr1-XTe5) due to heat loss and radiation effects. However in order to fully evaluate any material for potential thermoelectric use, the determination of the thermal conductivity of the material is necessary. We have recently developed a new technique called the parallel thermal conductance (PTC) technique to measure the thermal conductivity of such small samples. In this paper we describe the PTC method and measurements of the thermal conductivity of the pentatelluride materials will be presented for the first time. The potential of these materials for low temperature thermoelectric applications will be further evaluated given these results as well as future work and directions will be discussed.

Thermoelectric Properties of Bi2SrCo2O9 Tellurium-Doped Single Crystalline Whiskers

2005 ◽  
Vol 886 ◽  
Author(s):  
Dwayne Bourne ◽  
Xiaofeng Tang ◽  
Kelvin Aaron ◽  
Julius Barnes ◽  
James Payne ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermoelectric Properties ◽  
Thermal Conductance ◽  
Probe Method ◽  
Small Samples ◽  
Total Thermal Conductivity ◽  
Single Crystalline ◽  
Differential Technique ◽  
Conductance Technique

ABSTRACTLong single crystalline whiskers (10-200 µm diameter) were synthesized using tellurium-doped precursors. The length of these whiskers varies from less than 1 mm up to 9 mm. The thermopower and resistivity were approximately 150 µV/K and 5 mΩ-cm respectively at 325K. The thermopower was measured using a differential technique, while the resistivity was measured using a standard four-probe method. The thermal conductivity of these small samples was measured using our parallel thermal conductance technique. The total thermal conductivity was on the order of 2 Wm−1K−1.

Low-temperature thermal conductivity and boson peak in the glassy g-As2S3

2016 ◽  
Vol 39 (0) ◽  
pp. 66-72
Author(s):  
В. Міца ◽  
О. Фегер ◽  
С. Петрецький ◽  
Р. Голомб ◽  
В. Ткач
Keyword(s):  
Thermal Conductivity ◽  
Low Temperature ◽  
Boson Peak

Precise Cache Profiling for Studying Radiation Effects

2021 ◽  
Vol 20 (3) ◽  
pp. 1-25
Author(s):  
James Marshall ◽  
Robert Gifford ◽  
Gedare Bloom ◽  
Gabriel Parmer ◽  
Rahul Simha
Keyword(s):  
Radiation Effects ◽  
Fault Injection ◽  
Error Correcting Codes ◽  
Direct Access ◽  
Transient Faults ◽  
Large Area ◽  
Common Multiple ◽  
Single Event Upsets ◽  
On Chip ◽  
Future Work

Increased access to space has led to an increase in the usage of commodity processors in radiation environments. These processors are vulnerable to transient faults such as single event upsets that may cause bit-flips in processor components. Caches in particular are vulnerable due to their relatively large area, yet are often omitted from fault injection testing because many processors do not provide direct access to cache contents and they are often not fully modeled by simulators. The performance benefits of caches make disabling them undesirable, and the presence of error correcting codes is insufficient to correct for increasingly common multiple bit upsets. This work explores building a program’s cache profile by collecting cache usage information at an instruction granularity via commonly available on-chip debugging interfaces. The profile provides a tighter bound than cache utilization for cache vulnerability estimates (50% for several benchmarks). This can be applied to reduce the number of fault injections required to characterize behavior by at least two-thirds for the benchmarks we examine. The profile enables future work in hardware fault injection for caches that avoids the biases of existing techniques.

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