Thin Film Herringbone Buckling Patterns

2003 ◽  
Vol 795 ◽  
Author(s):  
Xi Chen ◽  
John W. Hutchinson

ABSTRACTThin metal film deposited on compliant substrate undergoes equi-biaxial compression and buckles into a highly ordered herringbone pattern [1,2]. In this study, it is shown that compare with the bifurcation competing modes, the herringbone mode has the lowest strain energy and therefore it is the preferred buckling pattern in the thin film.

1985 ◽  
Vol 12 (1) ◽  
pp. 9-32 ◽  
Author(s):  
C. R. Tellier

During the last decade some progress have been made in the field of sensors using thin film techniques. In particular thin metal film strain gauges and thin film temperature sensors based on the temperature dependent resistivity of metal are now commonly used. But changes in other transport parameters with various measurands are also useful for the design of metal film sensors. Difficulty arises in thin film techniques when structural defects are frozen in films.Intensive theoretical investigations are carried out to explain the effect of grain-boundary and external surface scatterings on transport parameters. Accordingly the main results are presented to specify the influence of film structure on the sensor performance. The grain-boundary effects are discussed according to applications of metal film sensors. Theoretical predictions are analyzed in terms of sensitivity, thermal stability and long term behavior. But other problems induced by the presence of grain boundaries or point defects are also discussed, in particular problems associated with bulk diffusion, electromigration induced failures or intrinsic stresses.


2012 ◽  
Vol 116 (22) ◽  
pp. 12149-12155 ◽  
Author(s):  
Shirly Borukhin ◽  
Cecile Saguy ◽  
Maria Koifman ◽  
Boaz Pokroy

1999 ◽  
Author(s):  
Seok Chung ◽  
Jun Keun Chang ◽  
Dong Chul Han

Abstract To make some MF.MS devices such as sensors and actuators be useful in the medical application, it is required to integrate this devices with power or sensor lines and to keep the hole devices biocompatible. Integrating micro machined sensors and actuators with conventional copper lines is incompatible because the thin copper lines are not easy to handle in the mass production. To achieve the compatibility of wiring method between MEMS devices, we developed the thin metal film deposition process that coats micropattered thin copper films on the non silicon-wafer substrate. The process was developed with the custom-made three-dimensional thin film sputter/evaporation system. The system consists of process chamber, two branch chambers, substrate holder unit and linear/rotary motion feedthrough. Thin metal film was deposited on the biocompatible polymer, polyurethane (PellethaneR) and silicone, catheter that is 2 mm in diameter and 1,000 mm in length. We deposited Cr/Cu and Ti/Cu layer and made a comparative study of the deposition processes, sputtering and evaporation. The temperature of both the processes were maintained below 100°C, for the catheter not melting during the processes. To use the films as signal lines connect the signal source to the actuator on the catheter tip, we machined the films into desired patterns with the eximer laser. In this paper, we developed the thin metal film deposition system and processes for the biopolymeric substrate used in the medical MEMS devices.


2013 ◽  
Vol 536 ◽  
pp. 142-146 ◽  
Author(s):  
C. Camerlingo ◽  
M.P. Lisitskiy ◽  
L. De Stefano ◽  
I. Rea ◽  
I. Delfino ◽  
...  

2006 ◽  
Vol 29 (2) ◽  
pp. 371-378 ◽  
Author(s):  
G. Norberg ◽  
S. Dejanovic ◽  
H. Hesselbom

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