TRANSITION BETWEEN E-MODE AND H-MODE IN A CYLINDRICAL INDUCTIVELY COUPLED PLASMA REACTOR

AbstractOrganosilicate materials with dielectric constants (k) ranging from 3.0 to 2.2 are in production or under development for use as interlayer dielectric materials in advanced interconnect logic technology. The dielectric constant of these materials is lowered through the addition of porosity which lowers the film density, making the patterning of these materials difficult. The etching kinetics and surface roughening of a series of low-k dielectric materials with varying porosity and composition were investigated as a function of ion beam angle in a 7% C4F8/Ar chemistry in an inductively-coupled plasma reactor. A similar set of low-k samples were patterned in a single damascene scheme. With a basic understanding of the etching process, we will show that it is possible to proactively design a low-k material that is optimized for a given patterning. A case study will be used to illustrate this point.

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Mechanical Stress in InP Structures Etched in an Inductively Coupled Plasma Reactor with Ar/Cl2/CH4 Plasma Chemistry

Journal of Electronic Materials ◽

10.1007/s11664-018-6152-6 ◽

2018 ◽

Vol 47 (9) ◽

pp. 4964-4969 ◽

Cited By ~ 2

Author(s):

Jean-Pierre Landesman ◽

Daniel T. Cassidy ◽

Marc Fouchier ◽

Erwine Pargon ◽

Christophe Levallois ◽

...

Keyword(s):

Mechanical Stress ◽

Inductively Coupled Plasma ◽

Plasma Reactor ◽

Plasma Chemistry ◽

Inductively Coupled ◽

Inductively Coupled Plasma Reactor

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Effect of chamber wall conditions on Cl and Cl2 concentrations in an inductively coupled plasma reactor

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films ◽

10.1116/1.1421602 ◽

2002 ◽

Vol 20 (1) ◽

pp. 43-52 ◽

Cited By ~ 95

Author(s):

Saurabh J. Ullal ◽

Anna R. Godfrey ◽

Erik Edelberg ◽

Linda Braly ◽

Vahid Vahedi ◽

...

Keyword(s):

Inductively Coupled Plasma ◽

Plasma Reactor ◽

Chamber Wall ◽

Inductively Coupled ◽

Inductively Coupled Plasma Reactor

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Low temperature growth of vertically aligned carbon nanofibres in a low frequency inductively coupled plasma reactor

2002 Conference on Optoelectronic and Microelectronic Materials and Devices. COMMAD 2002. Proceedings (Cat. No.02EX601) ◽

10.1109/commad.2002.1237221 ◽

2005 ◽

Cited By ~ 1

Author(s):

S. Xu ◽

Z. Tskadze ◽

J.D. Long ◽

K. Ostrikov ◽

N. Jiang

Keyword(s):

Low Temperature ◽

Inductively Coupled Plasma ◽

Plasma Reactor ◽

Low Frequency ◽

Carbon Nanofibres ◽

Temperature Growth ◽

Low Temperature Growth ◽

Inductively Coupled ◽

Inductively Coupled Plasma Reactor ◽

Vertically Aligned

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Deep Silicon Etching in Inductively Coupled Plasma Reactor for MEMS

Physica Scripta ◽

10.1238/physica.topical.079a00250 ◽

1999 ◽

Vol T79 (1) ◽

pp. 250 ◽

Cited By ~ 7

Author(s):

J. Kiiham?ki ◽

S. Franssila

Keyword(s):

Inductively Coupled Plasma ◽

Plasma Reactor ◽

Silicon Etching ◽

Inductively Coupled ◽

Inductively Coupled Plasma Reactor

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Analysis of Si substrate damage induced by inductively coupled plasma reactor with various superposed bias frequencies

2008 IEEE International Conference on Integrated Circuit Design and Technology and Tutorial ◽

10.1109/icicdt.2008.4567256 ◽

2008 ◽

Cited By ~ 3

Author(s):

Y. Nakakubo ◽

A. Matsuda ◽

M. Kamei ◽

H. Ohta ◽

K. Eriguchi ◽

...

Keyword(s):

Inductively Coupled Plasma ◽

Plasma Reactor ◽

Si Substrate ◽

Inductively Coupled ◽

Inductively Coupled Plasma Reactor

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Ferromagnetic Signal in Nanosized Ag Particles

Journal of Nanoscience and Nanotechnology ◽

10.1166/jnn.2007.062 ◽

2007 ◽

Vol 7 (11) ◽

pp. 3884-3887 ◽

Cited By ~ 2

Author(s):

Younghun Jo ◽

Myung-Hwa Jung ◽

Myung-Chul Kyum ◽

Sung-Ik Lee

Keyword(s):

Ag Nanoparticles ◽

Inductively Coupled Plasma ◽

Cooling System ◽

Plasma Reactor ◽

Cu Nanoparticles ◽

Inductively Coupled ◽

Ag Particles ◽

Inductively Coupled Plasma Reactor ◽

Liquid Nitrogen Cooling ◽

A New Technique

A new technique using an inductively coupled plasma reactor equipped with a liquid-nitrogen cooling system was developed to prepare Ag nanoparticles. The magnetic signal from these Ag particles with diameters of 4 nm showed, surprisingly, a signal with combined ferromagnetic and diamagnetic components, in contrast to the signal with only one diamagnetic component from bulk Ag. The same technique was used to prepare the Ag/Cu nanoparticles, which are Ag nanoparticles coated with a Cu layer. Compared to the Ag nanoparticles, these showed a greatly enhanced superparamagnetic signal in addition to the same value of the ferromagnetism. The comparison between the Ag and the Ag/Cu nanoparticles indicated that the ferromagnetic components are a common feature of Ag nanoparticles while the greatly enhanced paramagnetic component of Ag/Cu, which dominates over the background diamagnetic component from the Ag core, is from the outer Cu shell.

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