Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)
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A comprehensive study in thermal dissipation assessment of MPM-FCBGA

2004 ◽  
Author(s):  
Mingzong Wang ◽  
Jeng Yuan Lai ◽  
Yu-Po Wang ◽  
C.S. Hsiao
Keyword(s):  
Thermal Dissipation ◽  
Comprehensive Study

Printed wiring board with coaxial wirings for high speed signal transmission

2004 ◽  
Author(s):  
K. Kikuchi ◽  
N. Tanaka ◽  
H. Nakagawa ◽  
K. Tokoro ◽  
A. Kawashima ◽  
...  
Keyword(s):  
High Speed ◽  
Signal Transmission ◽  
Printed Wiring Board ◽  
Wiring Board

Thermal characterization of a thermally enhanced QFN package

2004 ◽  
Author(s):  
S. Krishnamoorthi ◽  
K.Y. Goh ◽  
D.Y.R. Chong ◽  
R. Kapoor ◽  
A.Y.S. Sun
Keyword(s):  
Thermal Characterization

Test strategies for fine pitch wafer level packaged devices

2004 ◽  
Author(s):  
J. Jayabalan ◽  
M.D. Rotaru ◽  
Deng Chun ◽  
Feng Han Hua ◽  
M.K. Iyer ◽  
...  
Keyword(s):  
Wafer Level ◽  
Test Strategies ◽  
Fine Pitch

New package/board materials technology for next-generation convergent microsystems

2004 ◽  
Author(s):  
N. Kumbhat ◽  
P.M. Raj ◽  
S. Bansal ◽  
R. Doraiswami ◽  
S. Bhattacharya ◽  
...  
Keyword(s):  
Next Generation
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