scholarly journals Enhancement of Heat Transfer for Electronic Components in Horizontal Channel by Passive Cooling.(Dept.M)

2021 ◽  
Vol 46 (2) ◽  
pp. 1-12
Author(s):  
Mohammed Salem ◽  
Gamal Sultan ◽  
Ahmed Hegazi ◽  
W. El Awady
Author(s):  
Abdelouahab Bouttout

The study in question consists to amplify the hydrodynamic and thermal instabilities by imposed pulsation during forced convection of air cooling of nine identical heated blocks simulate electronic components mounted on horizontal channel. The finite volume method has been used to solve the governing equations of unsteady forced convection. This approach uses control volume for velocities that are staggered with respect to those for temperature and pressure. The numerical procedure called SIMPLER is used to handle the pressure-velocity coupling. The results show that the time averaged Nusselt number for each heated block depends on the pulsation frequencies and is always larger than in the steady-state case. The new feature in this work is that we obtained a short band of frequencies which the enhancement of heat transfer of all electronic components is greater than 20 % compared with steady non pulsation flow. In addition, the gain in heat transfer Emax attainted the maximum value for the central blocks. Our numerical results were compared with other investigations and found to agree well with experimental data.


2021 ◽  
Vol 65 (2-4) ◽  
pp. 446-449
Author(s):  
D. Deepa ◽  
R. Thanigaivelan ◽  
K. Gunasekaran ◽  
S. Praveenkumar

The increase in usage of high performance micro-electronic components leads to increase in high heat generation. In order to increase the life time of the electron devices proper ventilation of heat needs to be planned with the available space. In the electronic system the space occupied by the heat sink is small, as well as the heat has to be dissipated without disturbance. There are two types of cooling arrangement namely active cooling and passive cooling. Active cooling requires additional system such as blower and fan over passive cooling. In this study rectangular and square fin micro-fins are fabricated on copper and aluminium for a height of 0.25mm, with spacing and thickness of 5mm to study the natural convective heat transfer. The study reveals that the rectangular geometry enhances the heat transfer rate by 3% compared to the square fin.


Author(s):  
Jungko Moni Chakma ◽  
Mohammad Zoynal Abedin

Heat generation of engineering appliances has bad effect in handling the system can cause the trouble, short life cycle of machines, frequent maintenance requirements and low reliability of systems. The passive cooling technique has been widely used to solve such problems. This review work summarizes the heat transfer enhancement technique in a rectangular fin with economic way. So many research about the enhancement of heat transfer by rectangular fins experimentally and numerically and found very significant result. In this review, various types of rectangular fin structures are studied simultaneously. It is revealed through reviewing the related literature that the highest value of equivalent heat transfer enhancement is found the increase in average heat transfer performance of inverted triangular notched fin 50.51% as compared with plane rectangular fin and the perforated fin total heat transfer rate increased by 38.9% compared to regular fin. Furthermore, by reduction of the optimal fin spacing, heat flux can be changed by 20% in standard rectangular fin when compared with regular fin spacing. Also cooling performance of the inclined rectangular fin with 60° of tilt angle is seen to be as 6% higher than solid rectangular fin. This article can be considered as a benchmark in the practical application for enhances the heat transfer rates.


2008 ◽  
Vol 39 (1) ◽  
pp. 79-90 ◽  
Author(s):  
S. A. Isaev ◽  
Alexander I. Leontiev ◽  
V. L. Zhdanov ◽  
N. Kornev ◽  
E. Hassel

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