scholarly journals Prediction of the contact thermal resistance of vertical carbon nanotube arrays

2020 ◽  
Vol 24 (2 Part A) ◽  
pp. 745-756
Author(s):  
Bo Shi ◽  
Han Zhang ◽  
Jin Zhang
Keyword(s):  
Experimental Data ◽  
Surface Roughness ◽  
Carbon Nanotube ◽  
Thermal Resistance ◽  
Interfacial Thermal Resistance ◽  
Nanotube Arrays ◽  
Thermal Interface Materials ◽  
Contact Thermal Resistance ◽  
Carbon Nanotube Arrays ◽  
Interface Materials

The vertical carbon nanotube arrays (VACNT), as a result of its flexibility and axial high thermal conductivity, exert a huge potential and play an increasingly important role in thermal interface materials. This paper proposed a model which can predict the contact thermal resistance of VACNT. The contact thermal resistance of VACNT under different pressures is calculated and compared with the experimental data. Also, the effect of variations in the surface roughness and VACNT parameters on the contact thermal resistance is investigated. Results show that the theoretical results are in good agreement with the experimental data. The contact thermal resistance is composed of interfacial thermal resistance, constriction thermal resistance, and VACNT resistance. Among which the interfacial thermal resistance is the major thermal resistance. The variations in VACNT length and diameter can change the bending degree of VACNT under the same pressure, which presents important implications on contact thermal resistance and can be used to optimize the contact thermal resistance of VACNT. The surface roughness exerts little effect on contact thermal resistance.

Denser and taller carbon nanotube arrays on Cu foils useable as thermal interface materials

2015 ◽  
Vol 54 (9) ◽  
pp. 095102 ◽  
Author(s):  
Nuri Na ◽  
Kei Hasegawa ◽  
Xiaosong Zhou ◽  
Mizuhisa Nihei ◽  
Suguru Noda
Keyword(s):  
Carbon Nanotube ◽  
Nanotube Arrays ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Carbon Nanotube Arrays ◽  
Interface Materials

Thermal Interface Materials Based on Vertically Aligned Carbon Nanotube Arrays: A Review

2019 ◽  
Vol 11 (1) ◽  
pp. 3-10 ◽  
Author(s):  
Guangjie Yuan ◽  
Haohao Li ◽  
Bo Shan ◽  
Johan Liu
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Nanotube Arrays ◽  
Thermal Interface Materials ◽  
Free Standing ◽  
Thermal Interface ◽  
Carbon Nanotube Arrays ◽  
Potential Applications ◽  
Vertically Aligned ◽  
Interface Materials

As the feature size of integrated circuit devices is shrinking to sub-7 nm node, the chip power dissipation significantly increases and mainly converted to the heat. Vertically Aligned Carbon Nanotube arrays (VACNTs) have a large number of outstanding properties, such as high axial thermal conductivity, low expansion coefficient, light-weight, anti-aging, and anti-oxidation. With a dramatic increment of chip temperature, VACNTs and their composites will be the promising materials as Thermal Interface Materials (TIMs), especially due to their high thermal conductivity. In this review, the synthesis, transfer and potential applications of VACNTs have been mentioned. Thermal Chemical Vapor Deposition (TCVD) has been selected for the synthesis of millimeter-scale VACNTs. After that, they are generally transferred to the target substrate for the application of TIMs in the electronics industry, using the solder transfer method. Besides, the preparation and potential applications of VACNTs-based composites are also summarized. The gaps of VACNTs are filled by the metals or polymers to replace the low thermal conductivity in the air and make them free-standing composites films. Compared with VACNTs- metal composites, VACNTs-polymer composites will be more suitable for the next generation TIMs, due to their lightweight, low density and good mechanical properties.

Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials

2015 ◽  
Vol 137 (3) ◽  
Author(s):  
Andrew J. McNamara ◽  
Yogendra Joshi ◽  
Zhuomin Zhang ◽  
Kyoung-sik Moon ◽  
Ziyin Lin ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Thermal Resistance ◽  
Prolonged Exposure ◽  
Silicon Substrates ◽  
Thermal Interface Materials ◽  
Total Thermal Resistance ◽  
Thermal Interface ◽  
Ir Microscopy ◽  
Vertically Aligned ◽  
Interface Materials

Recently, much attention has been given to reducing the thermal resistance attributed to thermal interface materials (TIMs) in electronic devices, which contribute significantly to the overall package thermal resistance. Thermal transport measured experimentally through several vertically aligned carbon nanotube (VACNT) array TIMs anchored to copper and silicon substrates is considered. A steady-state infrared (IR) microscopy experimental setup was designed and utilized to measure the cross-plane total thermal resistance of VACNT TIMs. Overall thermal resistance for the anchored arrays ranged from 4 to 50 mm2 KW-1. These values are comparable to the best current TIMs used for microelectronic packaging. Furthermore, thermal stability after prolonged exposure to a high-temperature environment and thermal cycling tests shows limited deterioration for an array anchored using a silver-loaded thermal conductive adhesive (TCA).

Heat Transfer During Evaporation on Capillary-Grooved Structures of Heat Pipes

1995 ◽  
Vol 117 (3) ◽  
pp. 740-747 ◽  
Author(s):  
D. Khrustalev ◽  
A. Faghri
Keyword(s):  
Heat Transfer ◽  
Experimental Data ◽  
Surface Roughness ◽  
Thermal Resistance ◽  
Heat Pipes ◽  
Liquid Films ◽  
Thin Liquid Films ◽  
Interfacial Thermal Resistance ◽  
Interfacial Resistance ◽  
The Heat Transfer Coefficient

A detailed mathematical model is developed that describes heat transfer through thin liquid films in the evaporator of heat pipes with capillary grooves. The model accounts for the effects of interfacial thermal resistance, disjoining pressure, and surface roughness for a given meniscus contact angle. The free surface temperature of the liquid film is determined using the extended Kelvin equation and the expression for interfacial resistance given by the kinetic theory. The numerical results obtained are compared to existing experimental data. The importance of the surface roughness and interfacial thermal resistance in predicting the heat transfer coefficient in the grooved evaporator is demonstrated.

Thermal resistance of the native interface between vertically aligned multiwalled carbon nanotube arrays and their SiO2/Si substrate

2008 ◽  
Vol 103 (2) ◽  
pp. 024911 ◽  
Author(s):  
Youngsuk Son ◽  
Sunil K. Pal ◽  
Theodorian Borca-Tasciuc ◽  
Pulickel M. Ajayan ◽  
Richard W. Siegel
Keyword(s):  
Carbon Nanotube ◽  
Thermal Resistance ◽  
Multiwalled Carbon Nanotube ◽  
Nanotube Arrays ◽  
Si Substrate ◽  
Multiwalled Carbon ◽  
Carbon Nanotube Arrays ◽  
Vertically Aligned
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