scholarly journals Kinetic Features of Reactive Diffusion between Sn–5Au Alloy and Ni at Solid-State Temperatures

2006 ◽  
Vol 47 (9) ◽  
pp. 2277-2284 ◽  
Author(s):  
Yu-ichi Yato ◽  
Masanori Kajihara
2007 ◽  
Vol 539-543 ◽  
pp. 2473-2478 ◽  
Author(s):  
M. Kajihara ◽  
T. Takenaka

The kinetics of the solid-state reactive diffusion between Au and Sn was experimentally observed using Sn/Au/Sn diffusion couples prepared by a diffusion bonding technique. The diffusion couples were isothermally annealed at a temperature of T = 453 K. Due to annealing, AuSn, AuSn2 and AuSn4 compound layers are formed at the interface in the diffusion couple. The experimental results were used to evaluate quantitatively the effect of Ni on the growth of the Au–Sn compounds. The evaluation indicates that the addition of Ni into Sn between 1 and 5 mass% accelerates the growth of the Au–Sn compounds at T = 433–473 K.


2017 ◽  
Vol 58 (1) ◽  
pp. 16-22 ◽  
Author(s):  
Yoshiki Takamatsu ◽  
Minho O ◽  
Masanori Kajihara

2006 ◽  
Vol 427 (1-2) ◽  
pp. 210-222 ◽  
Author(s):  
T. Takenaka ◽  
M. Kajihara ◽  
N. Kurokawa ◽  
K. Sakamoto

2007 ◽  
Vol 48 (10) ◽  
pp. 2642-2649 ◽  
Author(s):  
Shunsuke Sasaki ◽  
Masanori Kajihara

2006 ◽  
Vol 46 ◽  
pp. 126-135 ◽  
Author(s):  
Guido Schmitz ◽  
Constantin Ene ◽  
Ch. Lang ◽  
Vitaliy Vovk

Down-scaling is a major principle of modern technology. As a consequence, the stability of many technical devices is controlled by solid state reactions that proceed on the range of a few nanometres only. On such a short length scale even basic aspects of reaction physics as fundamental as e.g. the Ficks laws of diffusion, need to be reconsidered. Only very few dedicated techniques are suitable to study atomic transport and reactions with sufficient accuracy. Among them, the atom probe tomography is exceptional, as it allows the detection and localization of individual atoms with an accuracy of a lattice constant. An almost complete reconstruction of the 3D atomic arrangement of different atomic species gets possible. This article provides an overview on recent atom probe studies of reactive diffusion. After an introduction into the principles of the analysis method, physical mechanisms of solid state reactions are discussed in view of recent experiments at metallic thin film interfaces. How does nucleation of an interfacial product take place? In which way do grain boundaries influence the reaction? As a technical example, the stability of Cu/NiFe GMR sensor layers is discussed.


2005 ◽  
Vol 46 (5) ◽  
pp. 969-973 ◽  
Author(s):  
Ken Suzuki ◽  
Satoru Kano ◽  
Masanori Kajihara ◽  
Noriharu Kurokawa ◽  
Katsuhiko Sakamoto

2012 ◽  
Vol 323-325 ◽  
pp. 127-132
Author(s):  
M. Pawełkiewicz ◽  
Marek Danielewski ◽  
Jolanta Janczak-Rusch ◽  
Bartek Wierzba

The formation of intermetallic compounds (IMC) at the solder-substrate interface is required to initiate the metallurgical bond. However, rapid growth of IMCs may degrade joint strength through i) the increased presence of a low toughness phase, ii) the consumption of the solderable surface (void formation) and iii) generation of primary and secondary stresses. Knowledge of mass transport and reaction processes during joint formation and service life are essential for solder system design. The mathematical description of inter-and reactive diffusion in open system presented here is based on Darken method (bi-velocity), involving the different molar volumes in the system and Wagner boundary conditions. It combines the interdiffusion, reactive diffusion and the effective flux constraints to couple processes occurring at different time scales. The rCADiff software serves as a tool to simulate simultaneous growth of the two Cu-Sn IMCs.


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