scholarly journals Lifetime in Steel Cord Wire Drawing Dies of WC–Co Cemented Carbide Containing TaNbC or Cr3C2

2018 ◽  
Vol 59 (5) ◽  
pp. 754-759
Author(s):  
Masayuki Takada ◽  
Hideaki Matsubara ◽  
Yoshihiro Kawagishi
2012 ◽  
Vol 76 (6) ◽  
pp. 385-390 ◽  
Author(s):  
Masayuki Takada ◽  
Hideaki Matsubara ◽  
Yoshihiro Kawagishi

2021 ◽  
pp. 2150006
Author(s):  
XIN SONG ◽  
CHENG-CHUAN WANG ◽  
XIN-CHANG WANG ◽  
FANG-HONG SUN

Hot filament chemical vapor deposition (HFCVD) diamond-coated small aperture wire-drawing dies from [Formula: see text] to [Formula: see text][Formula: see text]mm are in high demand. A new deposition technique without filaments through the inner hole of wire-drawing dies is proposed, accompanied with the specially designed fixtures. Temperature distribution on the deposition surfaces is studied by computational fluid dynamics (CFD) simulation based on the finite volume method (FVM); both case study and mass production simulations are accomplished. Excellent performance and uniform multilayer MCD/NCD/MCD/NCD films are successfully deposited on the inner-hole surfaces of total 16 cemented carbide (WC-6wt.%Co) wire-drawing dies with an aperture of [Formula: see text][Formula: see text]mm in one batch. Drawing results of gas shield welding wires show that the lifespan of the multilayer diamond coated wire-drawing dies is about 20 times of the uncoated cemented carbide dies and 2 times of the monolayer MCD coated dies.


2017 ◽  
Vol 64 (1) ◽  
pp. 17-22 ◽  
Author(s):  
Masayuki TAKADA ◽  
Hideaki MATSUBARA ◽  
Yoshihiro KAWAGISHI

2013 ◽  
Vol 54 (10) ◽  
pp. 2011-2017 ◽  
Author(s):  
Masayuki Takada ◽  
Hideaki Matsubara ◽  
Yoshihiro Kawagishi

2012 ◽  
Vol 591-593 ◽  
pp. 850-853
Author(s):  
Huai Xing Wen ◽  
Yong Tao Yang

Drawing Dies meter A / D acquisition module will be collected from the mold hole contour data to draw a curve in Matlab. According to the mold pore structure characteristics of the curve, the initial cut-off point of each part of contour is determined and iteratived optimization to find the best cut-off point, use the least squares method for fitting piecewise linear and fitting optimization to find the function of the various parts of the curve function, finally calculate the pass parameters of drawing mode. Parameters obtained compare with the standard mold, both of errors are relatively small that prove the correctness of the algorithm. Also a complete algorithm flow of pass parameters is designed, it can fast and accurately measure the wire drawing die hole parameters.


2021 ◽  
Vol 1037 ◽  
pp. 203-208
Author(s):  
Valery V. Alisin ◽  
Michael A. Borik ◽  
Alexei V. Kulebyakin ◽  
Elena E. Lomonova ◽  
Dmitriy M. Gutsev

Materials based on partially stabilized zirconia (ceramics and crystals) are distinguished by high values of mechanical strength, crack resistance, hardness, corrosion resistance, low coefficient of friction when operating in tandem with most metals, which makes them promising materials for a wide tribotechnical application in highly loaded friction units. An example of such a unit is the die mechanism, which is an integral part of the drawing die tool in the cable industry. These hard precision tools (drawing dies or wire dies) actually determine the ultimate success in the wire drawing process.


2017 ◽  
Vol 24 (07) ◽  
pp. 1750090 ◽  
Author(s):  
LIANG WANG ◽  
JINFEI LIU ◽  
TANG TANG ◽  
FANGHONG SUN ◽  
NAN XIE

Diamond films have been deposited on the interior hole surface of cobalt-cemented tungsten carbide (WC–Co) drawing dies from acetone, trimethyl borate (C3H9BO3), tetraethoxysilane (C8H[Formula: see text]O4Si, TEOS) and hydrogen mixture by hot-filament chemical vapor deposition (HFCVD) method. The structures and quality of as-deposited diamond films are characterized with field-emission scanning electron microscopy (FESEM) and Raman spectroscopy. The abrasion ratio and the adhesive strength of as-deposited diamond films are evaluated by copper wire drawing tests and ultrasonic lapping tests, respectively. The results suggest that diamond films with small grain size and high growth rate can be obtained due to the mutual effects of boron and silicon impurities in the gas phases. The results of ultrasonic lapping tests show that diamond films doped with boron and/or silicon can bear the severe erosion of the large diamond powder. Diamond films peeling off within the reduction zone of the drawing dies cannot be observed after testing of 2[Formula: see text]h. The abrasion ratio of boron and silicon-added diamond films is five times that of diamond films without any addition. Adding boron and/or silicon in the diamond films is proved to be an efficient way to obtain high-adhesive-strength and high-abrasion-resistance diamond-coated drawing dies.


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