Short pulse laser welding of aluminum and copper alloys in dissimilar configuration

2020 ◽  
Vol 32 (2) ◽  
pp. 022025
Author(s):  
Alessandro Ascari ◽  
Alessandro Fortunato ◽  
Vincenzo Dimatteo
Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.


2013 ◽  
Vol 115 (4) ◽  
pp. 1469-1477 ◽  
Author(s):  
Evgeny Kharanzhevskiy ◽  
Sergey Reshetnikov

1994 ◽  
Author(s):  
Ronnie Shepherd ◽  
Rex Booth ◽  
Dwight Price ◽  
Rosemary Walling ◽  
Richard More ◽  
...  

2014 ◽  
Vol 30 ◽  
pp. e137
Author(s):  
A. Bona Matos ◽  
P.F. Cesar ◽  
L.T. Trevelin ◽  
B.T.F. Silva ◽  
C.S. Azevedo ◽  
...  

2005 ◽  
Author(s):  
Andreas Hertwig ◽  
Sven Martin ◽  
Wolfgang Kautek ◽  
Jörg Krüger

Sign in / Sign up

Export Citation Format

Share Document