The effects of short pulse laser surface cleaning on porosity formation and reduction in laser welding of aluminium alloy for automotive component manufacture

AC-170PX (AA6014) alloys are typically used in lightweight automobile vehicles. Laser welding can be a viable tool for the assembly of components. However, porosity is often generated during aluminium welding. In this article, an investigation is reported on the characteristics of porosity formation in high-power disc laser welding of AC-170PX aluminium alloy sheets in two weld joint configurations: fillet edge and flange couch with three different filler wires of 4xxx, 3xxx and 5xxx aluminium series for each joint. Porosity, microstructures, tensile strengths and joint geometry were investigated. It has been found that the use of filler wires with higher Mg and Mn content such as AA5083 and AA3004 leads to a significant reduction in porosity to less than 1.5% in both types of joints compared with up to 80% porosity with the silicon-rich AA4043 wire. The mechanism that led to this improvement is discussed.

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Inline process analysis and control using optical measurement for the ultra-short pulse laser ablation of CAD designed microstructures

International Congress on Applications of Lasers & Electro-Optics ◽

10.2351/1.5063164 ◽

2015 ◽

Author(s):

Marco Smarra ◽

Jens Hildenhagen ◽

Klaus Dickmann

Keyword(s):

Laser Ablation ◽

Pulse Laser ◽

Pulse Laser Ablation ◽

Optical Measurement ◽

Short Pulse ◽

Process Analysis ◽

Short Pulse Laser ◽

Ultra Short Pulse ◽

And Control ◽

Ultra Short Pulse Laser

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Ultra-Short Pulse Laser Ablation of Biological Hard Tissue and Biocompatibles

Journal of Laser Micro/Nanoengineering ◽

10.2961/jlmn.2008.01.0007 ◽

2008 ◽

Vol 3 (1) ◽

pp. 30-40 ◽

Cited By ~ 16

Author(s):

Martin Strassl

Keyword(s):

Laser Ablation ◽

Pulse Laser ◽

Pulse Laser Ablation ◽

Short Pulse ◽

Hard Tissue ◽

Short Pulse Laser ◽

Ultra Short Pulse ◽

Ultra Short Pulse Laser

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Silicon Thinning using Ultra-Short Pulse Laser Ablation

ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2004p0552 ◽

2004 ◽

Author(s):

F. Beaudoin ◽

P. Perdu ◽

C. DeNardi ◽

R. Desplats ◽

J. Lopez ◽

...

Keyword(s):

Laser Ablation ◽

Sample Preparation ◽

Pulse Laser ◽

Pulse Laser Ablation ◽

Short Pulse ◽

Special Care ◽

Short Pulse Laser ◽

Ultra Short Pulse ◽

Ultra Short Pulse Laser

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.

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