Inline process analysis and control using optical measurement for the ultra-short pulse laser ablation of CAD designed microstructures

Author(s):  
Marco Smarra ◽  
Jens Hildenhagen ◽  
Klaus Dickmann
Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.


2010 ◽  
Vol 101 (1) ◽  
pp. 97-101 ◽  
Author(s):  
Jeppe Byskov-Nielsen ◽  
Juha-Matti Savolainen ◽  
Martin Snogdahl Christensen ◽  
Peter Balling

Carbon ◽  
2018 ◽  
Vol 138 ◽  
pp. 234-242 ◽  
Author(s):  
Maximilian Spellauge ◽  
Florin-Cristian Loghin ◽  
Jürgen Sotrop ◽  
Matthias Domke ◽  
Marco Bobinger ◽  
...  

Procedia CIRP ◽  
2019 ◽  
Vol 81 ◽  
pp. 270-275 ◽  
Author(s):  
Andreas Kacaras ◽  
Matthias Bächle ◽  
Markus Schwabe ◽  
Frederik Zanger ◽  
Fernando Puente León ◽  
...  

2009 ◽  
Vol 517 (6) ◽  
pp. 1880-1886 ◽  
Author(s):  
R. Teghil ◽  
L. D'Alessio ◽  
A. De Bonis ◽  
D. Ferro ◽  
A. Galasso ◽  
...  

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