scholarly journals A Concept of Life and Remaining Life Prediction of High Temperature Structural Materials Based on the Characteristics of Creep-Fatigue Crack Propagation

1986 ◽  
Vol 72 (7) ◽  
pp. 711-719 ◽  
Author(s):  
Ryuichi OHTANI ◽  
Takayuki KITAMURA ◽  
Toshiya KINAMI
Keyword(s):  
Fatigue Crack ◽  
High Temperature ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Life Prediction ◽  
Structural Materials ◽  
Remaining Life ◽  
Creep Fatigue ◽  
Creep Fatigue Crack

Development of Flaw Evaluation System for Creep-Fatigue Crack Propagation of High-Temperature

2004 ◽  
Vol 261-263 ◽  
pp. 1307-1312
Author(s):  
K. Fujishita ◽  
Noriko Miura ◽  
Y. Takahashi ◽  
Yukihiro Nakayama
Keyword(s):  
Fatigue Crack ◽  
High Temperature ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Evaluation System ◽  
Central Research ◽  
J Integral ◽  
Creep Fatigue ◽  
Integral Range ◽  
Creep Fatigue Crack

Central Research Institute of Electric Power Industry (CRIEPI) has been conducting a research project on the verification of evaluation method for structural integrity of high-temperature components. As a part of the framework, we developed a flaw evaluation system on PC to predict creep-fatigue crack propagation, which was considered to be an essential crack driving force at high temperature especially in case where stresses caused by thermal loading were significant. The system is featured by easy and dialogical operation with graphical user interface. Fatigue and creep crack propagation behavior can be predicted using fatigue J-integral range and creep J-integral, respectively, which are the variations of the non-linear fracture mechanics parameter, J-integral. Both fatigue J-integral range and creep J-integral are calculated by the reference stress method with revised solutions developed by detailed finite element analysis.

scholarly journals OSO204 EBSD Study of Creep-Fatigue Crack Propagation in Lead Free Solder

2011 ◽  
Vol 2011 (0) ◽  
pp. _OS0204-1_-_OS0204-3_
Author(s):  
Keisuke TANAKA ◽  
Yusuke SAKAGAWA ◽  
Ryuji SHIBUE ◽  
Kazunari FUJIYAMA
Keyword(s):  
Fatigue Crack ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Creep Fatigue ◽  
Free Solder ◽  
Creep Fatigue Crack

scholarly journals Effect of Load Waveform on Creep-Fatigue Crack Propagation in Lead-Free Solder

2010 ◽  
Vol 59 (11) ◽  
pp. 833-839 ◽  
Author(s):  
Keisuke TANAKA ◽  
Takuya HIRASAWA ◽  
Yusuke SAKAGAWA ◽  
Kazunari FUJIYAMA
Keyword(s):  
Fatigue Crack ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Creep Fatigue ◽  
Free Solder ◽  
Creep Fatigue Crack
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