scholarly journals Application of markov chain to the reliability analysis of fatigue crack propagation process with nondestructive inspection.

1985 ◽  
Vol 34 (378) ◽  
pp. 327-332
Author(s):  
Yoshihiro SHIMADA ◽  
Takao NAKAGAWA ◽  
Hisanobu TOKUNO
Keyword(s):  
Markov Chain ◽  
Fatigue Crack ◽  
Crack Propagation ◽  
Reliability Analysis ◽  
Fatigue Crack Propagation ◽  
Nondestructive Inspection ◽  
Propagation Process ◽  
Crack Propagation Process

Local strain accumulation in fatigue crack propagation process of Ti-6Al-4V alloy

2016 ◽  
Vol 40 (5) ◽  
pp. 836-849 ◽  
Author(s):  
S. Ye ◽  
J. -G. Gong ◽  
S. -T. Tu ◽  
X. -C. Zhang ◽  
C. -C. Zhang
Keyword(s):  
Fatigue Crack ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Local Strain ◽  
Strain Accumulation ◽  
Propagation Process ◽  
Crack Propagation Process

scholarly journals The size effect on statistical properties of fatigue crack propagation process.

1986 ◽  
Vol 35 (393) ◽  
pp. 578-582 ◽  
Author(s):  
Akira TSURUI ◽  
Hiroshi ISHIKAWA ◽  
Akihiro UTSUMI ◽  
Akira SAKO
Keyword(s):  
Fatigue Crack ◽  
Size Effect ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Statistical Properties ◽  
Propagation Process ◽  
Crack Propagation Process

Nondestructive observation of fatigue crack propagation process in some solder joints by synchrotron radiation X-ray micro-tomography

2013 ◽  
Author(s):  
Hiroyuki Tsuritani ◽  
Toshihiko Sayama ◽  
Kentaro Uesugi ◽  
Yoshiyuki Okamoto ◽  
Takeshi Takayanagi ◽  
...  
Keyword(s):  
Fatigue Crack ◽  
Synchrotron Radiation ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Solder Joints ◽  
Propagation Process ◽  
X Ray ◽  
Crack Propagation Process ◽  
Micro Tomography

Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

2011 ◽  
Author(s):  
Hiroyuki Tsuritani ◽  
Toshihiko Sayama ◽  
Yoshiyuki Okamoto ◽  
Takeshi Takayanagi ◽  
Kentaro Uesugi ◽  
...  
Keyword(s):  
Fatigue Crack ◽  
Synchrotron Radiation ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Solder Joints ◽  
Fatigue Cracks ◽  
Propagation Process ◽  
X Ray ◽  
Micro Cracks ◽  
Crack Propagation Process

The reliability or lifetime of micro-joints on printed circuit boards (PCBs) is significantly affected by fatigue processes, including fatigue crack initiation and propagation to failure. Accordingly, the industries producing electronic devices and components strongly desire a new nondestructive inspection technology, which detects micro-cracks appearing as thermal fatigue fractures in the joints. In this investigation, we applied a synchrotron radiation X-ray micro-tomography system called the SP-μCT to three-dimensionally and nondestructively evaluate the fatigue crack propagation process in complex-shaped solder joints. The observed specimens have a typical joint structure in which chip type resistors 1.0 mm in length and 0.5 mm in width are mounted on an FR-4 substrate by joining with Sn-3.0Ag-0.5Cu solder. A thermal cycle test was carried out, and specimens were collected at fixed cycle numbers. The same solder joints were observed successively using the SP-μCT at beamline BL20XU at SPring-8, the largest synchrotron radiation facility in Japan. An X-ray energy of 29.0 keV was selected to obtain computed tomography (CT) images with high contrast among some components, and a refraction-contrast imaging technique was also applied to the visualization of fatigue cracks in the solder joints. The following results were obtained. At the early stage in the fatigue process of normal joints, the main fatigue cracks were clearly observed to initiate from the region around the solder joint tip and the vicinity of the chip corner. Additionally, many micro-cracks roughly 5 to 10 μm in length also formed in the thin solder layer between the chip and substrate. The important observed fact is that these micro-cracks deform, grow, and connect to each other due to the thermal cyclic loading, prior to main crack propagation. On the other hand, in case of solder joints which included relatively larger initial voids, the voids deformed, and the fatigue cracks initiated and propagated from the surface of the voids. Furthermore, by employing the three-dimensional crack images, the crack dimensions were quantified straightforwardly by measuring the surface area of the fatigue crack, and the fatigue crack propagation process was also accurately evaluated via the average crack propagation rate. Consequently, the obtained CT images clearly illustrate the process of crack propagation due to the thermal cyclic loading of a solder joint. In contrast, such information has not been obtained in any form by industrially employed X-ray CT systems or finite element analyses.

scholarly journals Fatigue crack propagation process of single edge-cracked FRP.

1985 ◽  
Vol 34 (378) ◽  
pp. 286-292 ◽  
Author(s):  
Sadao AMIJIMA ◽  
Toshio TANIMOTO ◽  
Takashi MATSUOKA ◽  
Masaaki MORI
Keyword(s):  
Fatigue Crack ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Single Edge ◽  
Propagation Process ◽  
Crack Propagation Process
Sign in / Sign up

Export Citation Format

Share Document