In-Flight Wing Deformation Measurement

2013 ◽  
Author(s):  
Mitsuru Kurita ◽  
Shunsuke Koike ◽  
Kazuyuki Nakakita ◽  
Kazuya Masui
Keyword(s):  
Deformation Measurement ◽  
Wing Deformation

Wing deformation measurement using the stereo-vision methods in the presence of camera movements

2021 ◽  
pp. 107161
Author(s):  
Yan Liu ◽  
Zhendong Ge ◽  
Yingtao Yuan ◽  
Xin Su ◽  
Xiang Guo ◽  
...  
Keyword(s):  
Stereo Vision ◽  
Deformation Measurement ◽  
Wing Deformation

Wing Deformation Measurement As Bases for In-flight Aerodynamics

2016 ◽  
Author(s):  
Rie Tagai ◽  
Kazuyuki Nakakita ◽  
Mitsuru Kurita ◽  
Tsutomu Nakajima
Keyword(s):  
Deformation Measurement ◽  
Wing Deformation

Free-surface deformation measurement

1997 ◽  
Author(s):  
H. Stahl ◽  
Kevin Stultz ◽  
H. Stahl ◽  
Kevin Stultz
Keyword(s):  
Free Surface ◽  
Surface Deformation ◽  
Deformation Measurement ◽  
Free Surface Deformation

An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages

2009 ◽  
Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai
Keyword(s):  
Thermal Stress ◽  
Failure Analysis ◽  
Deformation Measurement ◽  
Stress Conditions ◽  
Analysis Approach ◽  
New Approach ◽  
Reliability Improvement

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.

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