scholarly journals The application of the electromagnetic shielding technology in the design of the heat dissipation of the shipboard cabinet

2017 ◽  
Author(s):  
ShaoLin Cui ◽  
Chen Luo ◽  
XiangYu Li
Keyword(s):  
Heat Dissipation ◽  
Electromagnetic Shielding

scholarly journals The Progress of Composites with High Thermal Conductivity and Electromagnetic Shielding

2020 ◽  
Vol 1 (4) ◽  
pp. 18
Author(s):  
Houbao Liu ◽  
Renli Fu ◽  
Weisong Dong ◽  
Yingjie Song ◽  
Hao Zhang
Keyword(s):  
Thermal Conductivity ◽  
Composite Materials ◽  
Electromagnetic Interference ◽  
Heat Dissipation ◽  
Development Trend ◽  
Electromagnetic Shielding ◽  
High Thermal Conductivity ◽  
Heat Radiation ◽  
Electronic Components ◽  
High Package Density

<p>As electronic components develop toward high power, high package density, and device size miniaturization,  heat dissipation and electromagnetic interference between electronic components are becoming more and more serious. In order to solve the adverse elec  tromagnetic waves and heat radiation generated by electronic devices, people have high hopes for electronic packaging materials with high thermal conductivity and electromagnetic interference resistance. This paper summa  rizes the research status of high thermal conductivity composite materials and electromagnetic shielding composite materials. Finally, the latest research results of high thermal conductivity and electromagnetic shielding composites are introduced, and the future development trend of new materials for microelectronic packaging is prospected.</p>

ESTIMATION OF ELECTROMAGNETIC SHIELDING EFFICIENCY

2019 ◽  
Vol 78 (2) ◽  
pp. 181-189
Author(s):  
Ye. I. Gabrousenko ◽  
A. G. Holubnychyi ◽  
Zhengbing Hu ◽  
A. G. Taranenko ◽  
F. J. Yanovsky
Keyword(s):  
Electromagnetic Shielding

Integration of pure copper to optimize heat dissipation in injection mould inserts using laser metal deposition

2021 ◽  
Vol 33 (1) ◽  
pp. 012029
Author(s):  
Stefan Polenz ◽  
Christian Kolbe ◽  
Florian Bittner ◽  
Elena López ◽  
Frank Brückner ◽  
...  
Keyword(s):  
Heat Dissipation ◽  
Pure Copper ◽  
Metal Deposition ◽  
Laser Metal Deposition ◽  
Injection Mould
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