Design of a multimesa IMPATT diode array optimise for maximum heat dissipation

1991 ◽  
Vol 138 (2) ◽  
pp. 198
Author(s):  
A. Strum ◽  
A. Bar-Lev
Keyword(s):  
Heat Dissipation ◽  
Diode Array ◽  
Maximum Heat ◽  
Impatt Diode

Effectiveness of Composite Fins Under Maximum Heat Dissipation

2016 ◽  
Vol 38 (9) ◽  
pp. 867-880 ◽  
Author(s):  
Juan P. Luna-Abad ◽  
Francisco Alhama López
Keyword(s):  
Heat Dissipation ◽  
Maximum Heat

Experimental Study of a Single Microchannel Flow Under Non-Uniform Heat Flux

2017 ◽  
Author(s):  
Ahmed Eltaweel ◽  
Abdulla Baobeid ◽  
Ibrahim Hassan
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Dissipation ◽  
Hot Spot ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Uniform Heat Flux ◽  
Maximum Heat ◽  
Uniform Heat ◽  
Microchannel Heat Sinks

Non-uniform heat fluxes are commonly observed in thermo-electronic devices that require distinct thermal management strategies for effective heat dissipation and robust performance. The limited research available on non-uniform heat fluxes focus mostly on microchannel heat sinks while the fundamental component, i.e. a single microchannel, has received restricted attention. In this work, an experimental setup for the analysis of variable axial heat flux is used to study the heat transfer in a single microchannel with fully developed flow under the effect of different heat flux profiles. Initially a hot spot at different locations, with a uniform background heat flux, is studied at different Reynolds numbers while varying the maximum heat fluxes in order to compute the heat transfer in relation to its dependent variables. Measurements of temperature, pressure, and flow rates at a different locations and magnitudes of hot spot heat fluxes are presented, followed by a detailed analysis of heat transfer characteristics of a single microchannel under non-uniform heating. Results showed that upstream hotspots have lower tube temperatures compared to downstream ones with equal amounts of heat fluxes. This finding can be of importance in enhancing microchannel heat sinks effectiveness in reducing maximum wall temperatures for the same amount of heat released, by redistributing spatially fluxes in a descending profile.

Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices

2003 ◽  
Author(s):  
Gary L. Solbrekken ◽  
Kazuaki Yazawa ◽  
Avram Bar-Cohen
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
High Performance ◽  
Heat Dissipation ◽  
Electronic Equipment ◽  
Interfacial Thermal Resistance ◽  
Maximum Heat ◽  
Power Efficient ◽  
System Sensitivity ◽  
Heat Pumping

It is well established that the power dissipation for electronic components is increasing. At the same time, high performance portable equipment with volume, weight, and power limitations are gaining widespread acceptance in the marketplace. The combination of the above conditions requires thermal solutions that are high performance and yet small, light, and power efficient. This paper explores the possibility of using thermoelectric (TE) refrigeration as an integrated solution for portable electronic equipment accounting for heat sink and interface material thermal resistances. The current study shows that TE refrigeration can indeed have a benefit over using just a heat sink. Performance maps illustrating where TE refrigeration offers an advantage over an air-cooled heat sink are created for a parametric range of CPU heat flows, heat sink thermal resistances, and TE material properties. During the course of the study, it was found that setting the TE operating current based on minimizing the CPU temperature (Tj), as opposed to maximizing the amount of heat pumping, significantly reduces Tj. For the baseline case studied, a reduction of 20–30°C was demonstrated over a range of CPU heat dissipation. The parametric studies also illustrate that management of the heat sink thermal resistance appears to be more critical than the CPU/TE interfacial thermal resistance. However, setting the TE current based on a minimum Tj as opposed to maximum heat pumping reduces the system sensitivity to the heat sink thermal resistance.

Pool Boiling Heat Transfer With Binary Mixture on Open Microchannel Surface

2013 ◽  
Author(s):  
Ankit Kalani ◽  
Satish G. Kandlikar
Keyword(s):  
Binary Mixture ◽  
Heat Dissipation ◽  
Surface Effect ◽  
Pure Water ◽  
Pool Boiling ◽  
Electronics Cooling ◽  
Working Fluid ◽  
Two Phase ◽  
Maximum Heat ◽  
Fluid Medium

Two-phase cooling is considered an attractive option for electronics cooling due to its ability to dissipate large quantities of heat. In recent years, pool boiling has shown tremendous ability in high heat dissipation applications. Researchers have used various fluid medium for pool boiling including water, alcohol, refrigerants, nanofluids and binary mixture. In the current work, binary mixture of water with ethanol was chosen as the working fluid. Plain copper chip was used as the boiling surface. Effect of various concentrations of binary mixture was investigated. A maximum heat flux of 1720 kW/m2 at a wall superheat of 28°C was recorded for 15% ethanol in water. It showed a 1.5 fold increase in CHF over pure water.

scholarly journals Investigation of Heat Management in High Thermal Density Communication Cabinet by a Rear Door Liquid Cooling System

Energies ◽  
2019 ◽  
Vol 12 (22) ◽  
pp. 4385
Author(s):  
Wansheng Yang ◽  
Lin Yang ◽  
Junjie Ou ◽  
Zhongqi Lin ◽  
Xudong Zhao
Keyword(s):  
Data Center ◽  
Heat Dissipation ◽  
Cooling System ◽  
Operating Temperature ◽  
High Heat ◽  
Transformer Oil ◽  
Cooling Efficiency ◽  
Domestic Water ◽  
Maximum Heat ◽  
Rear Door

In this paper, a rear door oil-cooling heat exchanger for data center cabinet-level cooling has been proposed. In order to solve the heat dissipation problem of high heat density data center, this paper applied the mature transformer oil cooling technology to the data room. The heat dissipation of liquid-cooled cabinets and traditional air-cooled cabinets was compared, and the heat dissipation performance of the oil-cooled system was theoretically and experimentally investigated. To investigate the heat dissipation system, the cabinet operating temperature, circulating oil system temperature and cabinet exhaust temperature, cabinet heat density, oil flow rates and fan power were analyzed. It was found that the average cooling efficiency of the liquid-cooled cabinet increased by 66% compared with the average cooling efficiency of the conventional air-cooled cabinet. The operating temperature in air-cooled cabinets is as high as 55 °C, and the operating temperature in liquid-cooled cabinets does not exceed 50 °C. Among which, the maximum heat dissipation efficiency of the liquid-cooled cabinets can reach 58.8%. The oil temperature could reach 46.9 °C after heat exchange, and the exhaust air of the cabinet could reach 42.8 °C, which could be used to prepare domestic water and regenerative desiccant. The results from established calculation model agreed well with the testing results and the model could be used to predict the heat dissipation law of the oil cooling system under different conditions. The research has proposed the potential application of the oil-cooled in cabinet-level cooling, which can help realize saving primary energy and reducing carbon emission.

Investigation of Polymer Based Micro Heat Pipes for a Flexible Spacecraft Radiator

2001 ◽  
Author(s):  
D. McDaniels ◽  
G. P. “Bud” Peterson
Keyword(s):  
Heat Pipe ◽  
Heat Transport ◽  
Power Density ◽  
Polymeric Material ◽  
Heat Dissipation ◽  
Effective Conductivity ◽  
Chemical Reactivity ◽  
Working Fluid ◽  
Maximum Heat ◽  
Micro Heat Pipe

Abstract In response to the space industry’s pursuit of interplanetary travel and a continuous human presence in space, there is increasing focus on spacecraft that change configuration while in space. Flexible thermal radiators are being developed to accommodate various collapse and deployment mechanisms. An analytical model suggests that a lightweight polymeric material with imbedded micro heat pipe arrays can meet heat dissipation requirements while contributing less mass than competing flexible materials. The capillary pumping limit is evaluated as a function of operating temperature using two candidate working fluids. Using water, the maximum heat transport is 18 mW per channel at 140/160 °C. The maximum heat transport using methanol is 2.2 mW at 120 °C, an order-of magnitude difference. A thermal circuit model translates heat transport per channel into total radiator capacity as a function of source temperature and environmental sink temperature. Using water as the working fluid, the radiator capacity was shown to vary from 6.0 kW to 12.2 kW for source temperatures of 20 °C to 50 °C. For source temperatures of 40 °C and higher, the capacity meets or exceeds the dissipation requirements of a reference spacecraft design. While evaluated, methanol is not recommended as a working fluid because its radiator capacity is two to three times lower than water. Although thermal system constraints place limits on the micro heat pipe operating range, design changes directed at alleviating capillary limitations should increase radiator capacity. Technical issues for further study include effects of film billowing, performance limitations related to vapor viscosity, working fluid diffusion, and chemical reactivity between case and working fluid. Compared to a competing graphite fiber weave, the polymeric material has an effective conductivity over ten times higher. Its area power density (in kW/m2) is 18% to 60% lower than the graphite weave, but its mass power density (in kW/kg) is several times higher. Greater flexibility and lower weight also make it more amenable to structural integration. Recently developed space-stable polymers offer resistance to harsh temperature and radiation environments, helping to clear the path toward a more extensive use of polymers within the space industry.

Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards

2011 ◽  
Vol 133 (3) ◽  
Author(s):  
M. O. Özdemir ◽  
H. Yüncü
Keyword(s):  
Forced Convection ◽  
Heat Dissipation ◽  
Rectangular Channel ◽  
Numerical Procedure ◽  
Temperature Fields ◽  
Parallel Plates ◽  
Constant Property ◽  
Maximum Heat ◽  
Maximum Heat Transfer ◽  
Optimal Spacing

The objective of this study is to predict numerically the optimal spacing between parallel heat generating boards. The isothermal boards are stacked in a fixed volume of electronic package enclosed by insulated lateral walls, and they are cooled by laminar forced convection of air with prescribed pressure drop. In the numerical procedure, governing equations for the solution of forced convection of constant property incompressible flow through one rectangular channel are solved. Resulting flow and temperature fields in each rectangular channel yield the optimal board-to-board spacing by which maximum heat dissipation rate from the package to the air is achieved. Next, generalized correlations for the determination of the maximum heat transfer rate from the package and optimal spacing between boards are derived in terms of prescribed pressure difference, board length, and density and kinematic viscosity of air. Finally, corresponding correlations are compared with the available two-dimensional studies in literature for infinite parallel plates.

scholarly journals Heat Transfer between an Individual Carbon Nanotube and Gas Environment in a Wide Knudsen Number Regime

2013 ◽  
Vol 2013 ◽  
pp. 1-7 ◽  
Author(s):  
Hai-Dong Wang ◽  
Jin-Hui Liu ◽  
Xing Zhang ◽  
Tian-Yi Li ◽  
Ru-Fan Zhang ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Carbon Nanotube ◽  
Transfer Coefficient ◽  
Heat Dissipation ◽  
Critical Diameter ◽  
Maximum Heat ◽  
Maximum Heat Transfer ◽  
Efficient Prediction ◽  
Gas Environment

Applications of carbon nanotube (CNT) and graphene in thermal management have recently attracted significant attention. However, the lack of efficient prediction formula for heat transfer coefficient between nanomaterials and gas environment limits the further development of this technique. In this work, a kinetic model has been established to predict the heat transfer coefficient of an individual CNT in gas environment. The heat dissipation around the CNT is governed by molecular collisions, and outside the collision layer, the heat conduction is dominant. At nanoscales, the natural convection can be neglected. In order to describe the intermolecular collisions around the CNT quantitatively, a correction factor 1/24 is introduced and agrees well with the experimental observation. The prediction of the present model is in good agreement with our experimental results in free molecular regime. Further, a maximum heat transfer coefficient occurs at a critical diameter of several nanometers, providing guidelines on the practical design of CNT-based heat spreaders.

Experimental Study of a Single Microchannel Flow Under Nonuniform Heat Flux

2019 ◽  
Vol 12 (1) ◽  
Author(s):  
Ahmed Eltaweel ◽  
Ibrahim Hassan
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Dissipation ◽  
Hot Spot ◽  
Management Strategies ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Nonuniform Heating ◽  
Maximum Heat ◽  
Microchannel Heat Sinks

Abstract Nonuniform heat fluxes are commonly observed in thermo-electronic devices that require distinct thermal management strategies for effective heat dissipation and robust performance. The limited research available on nonuniform heat fluxes focus mostly on microchannel heat sinks while the fundamental component, i.e., a single microchannel, has received restricted attention. In this work, an experimental setup for the analysis of variable axial heat flux is used to study the heat transfer in a single microchannel with fully developed flow under the effect of different heat flux profiles. Initially, a hot spot at different locations, with a uniform background heat flux, is studied at different Reynolds numbers, while varying the maximum heat fluxes in order to compute the heat transfer in relation to its dependent variables. Measurements of temperature, pressure, and flow rates at a different locations and magnitudes of hot spot heat fluxes are presented, followed by a detailed analysis of heat transfer characteristics of a single microchannel under nonuniform heating. Results showed that upstream hotspots have lower tube temperatures compared to downstream ones with equal amounts of heat fluxes. This finding can be of importance in enhancing microchannel heat sinks effectiveness in reducing maximum wall temperatures for the same amount of heat released, by redistributing spatially fluxes in a descending profile.

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