scholarly journals Crack separation mechanism applied in CO2 laser machining of thick Polycrystalline Cubic Nitride (PCBN) tool blanks

2015 ◽  
Author(s):  
Yixian Wang
Keyword(s):  
Co2 Laser ◽  
Laser Machining ◽  
Separation Mechanism ◽  
Pcbn Tool

Hybrid CO2 Laser/Waterjet Machining of Polycrystalline Diamond Substrate: Material Separation Through Transformation Induced Controlled Fracture

2014 ◽  
Vol 136 (4) ◽  
Author(s):  
Dinesh Kalyanasundaram ◽  
Andrea Schmidt ◽  
Pal Molian ◽  
Pranav Shrotriya
Keyword(s):  
Co2 Laser ◽  
Polycrystalline Diamond ◽  
Substrate Material ◽  
Stress Fields ◽  
Separation Mechanism ◽  
Raman Spectrometry ◽  
Waterjet Machining ◽  
Machining System ◽  
Material Separation ◽  
Controlled Fracture

This paper presents a combined experimental and computational investigation of a novel material separation mechanism in polycrystalline diamond (PCD) substrates. A hybrid CO2 laser/waterjet (CO2-LWJ) machining system that combines a CO2 laser for localized heating and an abrasive-free waterjet to rapidly quench the heated area is utilized for cutting experiments on PCD substrates. Scanning electron microscopy (SEM) and micro-Raman spectrometry characterization performed on the cut surfaces show that cut surfaces were divided into two zones—a thin transformed zone near the top where the PCD grains have transformed to graphite and diamond-like carbon; and a fracture zone with the same composition as-received substrate. The experimental results indicate that the PCD substrates were cut through a “score and snap” mechanism—laser heating leads to localized damage and phase transformation of surface layers; and subsequently, stress fields developed due to constrained expansion of transformed material and waterjet quenching act on the laser made “score” to propagate crack through the thickness. Analytical solutions for thermal diffusion and force equilibrium are used to determine the temperature and stress fields in the PCD substrate during CO2-LWJ cutting. Fracture mechanics analysis of crack propagation is performed to demonstrate the feasibility of the “score and snap” mechanism for cutting of PCD substrates.

Fabrication of Tree Type Micro-Mixer with Circular Baffles Using CO2 Laser Machining

2021 ◽  
pp. 1039-1046
Author(s):  
Sachin R. Gavali ◽  
Sandeep S. Wangikar ◽  
Avinash K. Parkhe ◽  
Prashant M. Pawar
Keyword(s):  
Co2 Laser ◽  
Laser Machining ◽  
Micro Mixer ◽  
Tree Type

scholarly journals Fabrication of Micro Channel Mold by using CO2 Laser Machining

2019 ◽  
Vol 5 (4) ◽  
Author(s):  
Mayur M. Jokare ◽  
Abhishek H. Vedpathak ◽  
Rajendra D. Pawar ◽  
Digambar T. Kashid ◽  
Sandeep S. Wangikar
Keyword(s):  
Co2 Laser ◽  
Laser Machining ◽  
Micro Channel

Parametric Influence Study for Laser Cutting on Acrylic

2021 ◽  
Author(s):  
Sandeep S. Wangikar ◽  
Manthan M Dixit ◽  
Saurabh G Wadekar ◽  
Harshal R Nagtilak ◽  
Nitin D Hingmire ◽  
...  
Keyword(s):  
Co2 Laser ◽  
Process Parameters ◽  
Laser Power ◽  
Laser Cutting ◽  
Scanning Speed ◽  
Laser Machining ◽  
Response Measure ◽  
Machining Processes ◽  
The One ◽  
Day By Day

Laser has been employed for producing the complex specimens very efficiently and magnificently. The use of acrylic components is becoming prevalent day by day. Hence it is required to study the various machining techniques for engraving or cutting of acrylic material. The one of the non-traditional machining processes which can be employed efficiently for machining of acrylic is CO2 laser machining. The parametric study of acrylic materials by using CO2 laser machining is discussed in this paper. The scanning speed and the laser power were considered as process parameters and the influence of these parameters is studied on the depth as response measure. The engraving depth is observed to be increasing with increase in power and noted to be decreasing with increase in the scanning speed.

Progress and Research Status of CO2 Laser Machining Polymer Microfluidic Chips

2013 ◽  
Vol 316-317 ◽  
pp. 1007-1013 ◽  
Author(s):  
Heng Fu Xiang ◽  
Li Jun Zhang
Keyword(s):  
Co2 Laser ◽  
Process Parameters ◽  
Polymer Substrate ◽  
Laser Machining ◽  
Microfluidic Chips ◽  
Fabrication Method ◽  
Direct Writing ◽  
Laser Process ◽  
High Efficient ◽  
Material Fabrication

CO2 laser rapidly patterning microfluidic chips on polymer substrate with direct writing ablation had attracted many experts from domestic and foreign in resent years. This method had features of flexible, rapid, easily controllable and high efficient, and was regarded as the most potentialized fabrication method to improve the development of microfluidic systems. This paper systematically reviewed polymer substrate materials, the mechanism of laser and material, fabrication models and factors influenced the fabrication process, as well as the influence on microfluidic chips fabrication quality by laser process parameters. Moreover, the existent problems and possible resolutions based on the mechanisms of interactions between laser and materials was analyzed.

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