Hydrogen Embrittlement of a Copper Lead in a Diode

Abstract Hidurel 5 is a precipitation-hardening copper-nickel-silicon bronze alloy with high conductivity and strength, corrosion resistance to marine environments and hydrogen embrittlement, and good antifrictional properties. This datasheet provides information on composition, physical properties, hardness, tensile properties, and shear strength as well as fracture toughness. It also includes information on machining. Filing Code: CU-607. Producer or source: Langley Alloys Ltd.

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ANACONDA ALLOY 1870

Alloy Digest ◽

10.31399/asm.ad.cu0318 ◽

1976 ◽

Vol 25 (9) ◽

Keyword(s):

Corrosion Resistance ◽

Shear Strength ◽

Hydrogen Embrittlement ◽

Physical Properties ◽

Tensile Properties ◽

Heat Treating ◽

High Conductivity ◽

Reducing Atmosphere

Abstract ANACONDA Alloy 1870 is a free-cutting high-conductivity copper. It is a deoxidized copper with lead added to impart free-cutting properties. The various and unusual properties of Alloy 1870 make it suitable for many applications in the manufacture of parts machined from rods and for current-carrying studs, nuts and bolts designed for use at normal temperatures. Because it is deoxidized, it is not susceptible to hydrogen embrittlement if heated in a reducing atmosphere. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and shear strength. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Cu-318. Producer or source: Anaconda American Brass Company.

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Backside Mechanical Preparation Methodology for Effective Failure Analysis on Small and Non-Exposed Die Paddle Package

10.31399/asm.cp.istfa2018p0525 ◽

2018 ◽

Author(s):

Ong Pei Hoon ◽

Ng Kiong Kay ◽

Gwee Hoon Yen

Keyword(s):

Failure Analysis ◽

Chemical Etching ◽

Chemical Resistance ◽

Etching Time ◽

Lead Frame ◽

Front Side ◽

Electrical Measurements ◽

Mechanical Preparation ◽

Die Surface ◽

Copper Lead

Abstract Chemical etching is commonly used in exposing the die surface from die front-side and die backside because of its quick etching time, burr-free and stress-free. However, this technique is risky when performing copper lead frame etching during backside preparation on small and non-exposed die paddle package. The drawback of this technique is that the copper leads will be over etched by 65% Acid Nitric Fuming even though the device’s leads are protected by chemical resistance tape. Consequently, the device is not able to proceed to any other further electrical measurements. Therefore, we introduced mechanical preparation as an alternative solution to replace the existing procedure. With the new method, we are able to ensure the copper leads are intact for the electrical measurements to improve the effectiveness and accuracy of physical failure analysis.

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