X-Ray Diffraction Residual-Stress Measurement in Failure Analysis

2021 ◽  
pp. 221-239
Author(s):  
J.A. Pineault ◽  
M. Belassel ◽  
M.E. Brauss
1985 ◽  
Vol 107 (2) ◽  
pp. 185-191 ◽  
Author(s):  
C. O. Ruud ◽  
R. N. Pangborn ◽  
P. S. DiMascio ◽  
D. J. Snoha

A unique X-ray diffraction instrument for residual stress measurement has been developed that provides for speed, ease of measurement, accuracy, and economy of surface stress measurement. Application of this instrument with a material removal technique, e.g., electropolishing, has facilitated detailed, high resolution studies of three-dimensional stress fields. This paper describes the instrumentation and techniques applied to conduct the residual stress measurement and presents maps of the residual stress data obtained for the surfaces of a heavy 2 1/4 Cr 1 Mo steel plate weldment.


2009 ◽  
Vol 2009.46 (0) ◽  
pp. 385-386
Author(s):  
Koji Hattori ◽  
Mitsuyoshi Nakatani ◽  
Tomoki Takehashi ◽  
Masamitsu Abe ◽  
Toshihiko Sasaki

Sign in / Sign up

Export Citation Format

Share Document