scholarly journals Anisotropic Thermal Expansion of Transparent Cellulose Nanopapers

2020 ◽  
Vol 8 ◽  
Author(s):  
Takayuki Hirano ◽  
Kana Mitsuzawa ◽  
Shun Ishioka ◽  
Kazuho Daicho ◽  
Hiroto Soeta ◽  
...  
1979 ◽  
Vol 9 (1) ◽  
pp. 1-20 ◽  
Author(s):  
M Hasegawa ◽  
W H Young ◽  
M J Stott

Author(s):  
Jun Wu ◽  
Honggang Liu ◽  
Zhiyu He ◽  
Hui Luo ◽  
Baojun Chen ◽  
...  

ChemInform ◽  
2015 ◽  
Vol 46 (10) ◽  
pp. no-no
Author(s):  
Hai-Feng Li ◽  
Andrew Wildes ◽  
Binyang Hou ◽  
Cong Zhang ◽  
Berthold Schmitz ◽  
...  

1990 ◽  
Vol 23 (8) ◽  
pp. 1073-1075 ◽  
Author(s):  
Lin Wei ◽  
Dai Guiqing ◽  
Huang Qingzhen ◽  
Zhen An ◽  
Liang Jingkui

2020 ◽  
Vol 116 (8) ◽  
pp. 083101
Author(s):  
Rui-Zi Zhang ◽  
Jian Liu ◽  
Yu-Yang Zhang ◽  
Shixuan Du ◽  
Sokrates T. Pantelides

2017 ◽  
Vol 19 (36) ◽  
pp. 24436-24439 ◽  
Author(s):  
Zhanning Liu ◽  
Chenxi Liu ◽  
Qiang Li ◽  
Jun Chen ◽  
Xianran Xing

Spring-like thermal motion caused large anisotropic thermal expansion in nonporous coordination polymers.


1990 ◽  
Vol 216 ◽  
Author(s):  
J. Malamas ◽  
R.P. Bambha ◽  
J.B. Ramsey ◽  
W.C. Garrett ◽  
E.G. Kelso ◽  
...  

ABSTRACTWe report the investigation of an interconnect circuit board (ICB) with anisotropic thermal expansion for use with bump bonded, indirect hybrid, scanning focal plane arrays. This ICB is designed to reduce significantly the thermal stresses on the indium bump bonds during thermal cycling. Highly oriented pyrolitic graphite (HOPG) was chosen because its anisotropic thermal expansion meets the criteria for forming an indirect hybrid ICB using silicon processor circuits and mecury cadmium telluride detectors. Properties of HOPG influencing its performance as an ICB have been investigated including thermal expansion, electrical conductivity, durability, and adherence of electrically insulating thin films.


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