scholarly journals Cross-Protocol Unfairness between Adaptive Streaming Clients over HTTP/3 and HTTP/2: A Root-Cause Analysis

Electronics ◽  
2021 ◽  
Vol 10 (15) ◽  
pp. 1755
Author(s):  
Chanh Minh Tran ◽  
Tho Nguyen Duc ◽  
Phan Xuan Tan ◽  
Eiji Kamioka

With the introduction of HTTP/3, whose transport is no longer the traditional TCP protocol but the novel QUIC protocol, research for solutions to the unfairness of Adaptive Streaming over HTTP (HAS) has become more challenging. In other words, because of different transport layers, the HTTP/3 may not be available for some networks and the clients have to use HTTP/2 for their HAS applications instead. Therefore, the scenario in which HAS over HTTP/3 (HAS/3) competes against HTTP/2 (HAS/2) must be considered seriously. However, there has been a shortage of investigations on the performance and the origin of the unfairness in such a cross-protocol scenario in order to produce proper solutions. Therefore, this paper provides a performance evaluation and root-cause analysis of the cross-protocol unfairness between HAS/3 and HAS/2. It is concluded that, due to differences in the congestion control mechanisms of QUIC and TCP, HAS/3 clients obtain larger congestion windows, thus requesting higher video bitrates than HAS/2. As the problem lies in the transport layer, existing client-side ABR-based solutions for the unfairness from the application layer may perform suboptimally for the cross-protocol case.

Author(s):  
Chanh Minh Tran ◽  
Tho Nguyen Duc ◽  
Phan Xuan Tan ◽  
Eiji Kamioka

With the introduction of HTTP/3, whose transport is no longer the traditional TCP protocol but the novel QUIC protocol, research for solutions to the unfairness of Adaptive Streaming over HTTP (HAS) has become more challenging. That is, because of different transport layers, the HTTP/3 may not be available for some networks and the clients have to use HTTP/2 for their HAS applications instead. Therefore, the scenario that HAS over HTTP/3 (HAS/3) compete against HTTP/2 (HAS/2) must be considered seriously. However, there have been a shortage of investigations on the performance and the origin of the unfairness in such a cross-protocol scenario in order to produce proper solutions. Therefore, this paper provides a performance evaluation and root-cause analysis of the cross-protocol unfairness between HAS/3 and HAS/2. It is concluded that, due to differences in the congestion control mechanisms of QUIC and TCP, HAS/3 clients obtain larger congestion windows, thus requesting higher video bitrates than HAS/2. As the problem lies in the transport layer, existing client-side ABR-based solutions for the unfairness from the application layer may perform suboptimally for the cross-protocol case.


2011 ◽  
pp. 78-86
Author(s):  
R. Kilian ◽  
J. Beck ◽  
H. Lang ◽  
V. Schneider ◽  
T. Schönherr ◽  
...  

2012 ◽  
Vol 132 (10) ◽  
pp. 1689-1697
Author(s):  
Yutaka Kudo ◽  
Tomohiro Morimura ◽  
Kiminori Sugauchi ◽  
Tetsuya Masuishi ◽  
Norihisa Komoda

Author(s):  
Dan Bodoh ◽  
Kent Erington ◽  
Kris Dickson ◽  
George Lange ◽  
Carey Wu ◽  
...  

Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits of 1064nm time resolved LADA (TR-LADA) with a picosecond laser. It shows several examples of how picosecond TR-LADA has complemented the existing fault isolation toolset and has allowed for quicker resolution of design and manufacturing issues. The paper explains how TR-LADA increases the LADA localization resolution by eliminating the well interaction, provides the timing of the event detected by LADA, indicates the propagation direction of the critical signals detected by LADA, allows the analyst to infer the logic values of the critical signals, and separates multiple interactions occurring at the same site for better understanding of the critical signals.


Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.


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