Influence of Helium plasma pre-treatment on properties of polycrystalline silicon films

2013 ◽  
Vol 30 (4) ◽  
pp. 398-403
Author(s):  
Lili Ru ◽  
Yuedong Meng ◽  
Longwei Chen
Author(s):  
H. Yen ◽  
E. P. Kvam ◽  
R. Bashir ◽  
S. Venkatesan ◽  
G. W. Neudeck

Polycrystalline silicon, when highly doped, is commonly used in microelectronics applications such as gates and interconnects. The packing density of integrated circuits can be enhanced by fabricating multilevel polycrystalline silicon films separated by insulating SiO2 layers. It has been found that device performance and electrical properties are strongly affected by the interface morphology between polycrystalline silicon and SiO2. As a thermal oxide layer is grown, the poly silicon is consumed, and there is a volume expansion of the oxide relative to the atomic silicon. Roughness at the poly silicon/thermal oxide interface can be severely deleterious due to stresses induced by the volume change during oxidation. Further, grain orientations and grain boundaries may alter oxidation kinetics, which will also affect roughness, and thus stress.Three groups of polycrystalline silicon films were deposited by LPCVD after growing thermal oxide on p-type wafers. The films were doped with phosphorus or arsenic by three different methods.


1986 ◽  
Vol 98 (2) ◽  
pp. 383-390 ◽  
Author(s):  
F. L. Edelman ◽  
J. Heydenreich ◽  
D. Hoehl ◽  
J. Matthäi ◽  
I. Melnik ◽  
...  

1988 ◽  
Vol 162 ◽  
pp. 365-374 ◽  
Author(s):  
V.M. Koleshko ◽  
V.F. Belitsky ◽  
I.V. Kiryushin

2004 ◽  
Vol 265 (1-2) ◽  
pp. 168-173 ◽  
Author(s):  
Axel Straub ◽  
Per I. Widenborg ◽  
Alistair Sproul ◽  
Yidan Huang ◽  
Nils-Peter Harder ◽  
...  

1995 ◽  
Vol 66 (11) ◽  
pp. 1394-1396 ◽  
Author(s):  
R. Carluccio ◽  
J. Stoemenos ◽  
G. Fortunato ◽  
D. B. Meakin ◽  
M. Bianconi

1991 ◽  
Vol 138 (1) ◽  
pp. 214-219 ◽  
Author(s):  
Yangyuan Wang ◽  
Jiang Tao ◽  
Shen Tong ◽  
Tiejun Sun ◽  
Aizhen Zhang ◽  
...  

1992 ◽  
Vol 31 (Part 2, No. 10A) ◽  
pp. L1392-L1395 ◽  
Author(s):  
Hiroaki Kakinuma ◽  
Mikio Mohri ◽  
Taiji Tsuruoka

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