The Influence of Media Concentrations on the Passivation Layer Characteristics of Al-Zn Alloys in Brine Environment

2008 ◽  
Vol 1 (2) ◽  
pp. 113-121 ◽  
Author(s):  
C.E. Ekuma ◽  
N.E. Idenyi ◽  
F.K. Onwu ◽  
A.E. Umahi
Keyword(s):  
Passivation Layer ◽  
Brine Environment ◽  
Zn Alloys

Studies on a Novel Qualification Method of Silicon Nitride Layer

2016 ◽  
Author(s):  
Younan Hua ◽  
Bingsheng Khoo ◽  
Henry Leong ◽  
Yixin Chen ◽  
Eason Chan ◽  
...  
Keyword(s):  
Silicon Nitride ◽  
Silicon Substrate ◽  
Nitride Layer ◽  
Passivation Layer ◽  
Wafer Fabrication ◽  
Wafer Surface ◽  
Si3n4 Layer ◽  
Silicon Nitride Layer ◽  
Passivation Layers ◽  
Pinhole Test

Abstract In wafer fabrication, a silicon nitride (Si3N4) layer is widely used as passivation layer. To qualify the passivation layers, traditionally chemical recipe PAE (H3PO4+ HNO3) is used to conduct passivation pinhole test. However, it is very challenging for us to identify any pinholes in the Si3N4 layer with different layers underneath. For example, in this study, the wafer surface is Si3N4 layer and the underneath layer is silicon substrate. The traditional receipt of PAE cannot be used for passivation qualification. In this paper, we will report a new recipe using KOH solution to identify the pinhole in the Si3N4 passivation layer.

Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer

2021 ◽  
pp. 2100002
Author(s):  
Yunjo Jeong ◽  
Ossie Douglas ◽  
Utkarsh Misra ◽  
Md Rubayat‐E Tanjil ◽  
Kenji Watanabe ◽  
...  
Keyword(s):  
Boron Nitride ◽  
Hexagonal Boron Nitride ◽  
Passivation Layer ◽  
Metal Interconnects

Modelling the thermodynamic data for hcp Zn and Cu–Zn alloys– an ab initio and calphad approach

Calphad ◽  
2021 ◽  
Vol 72 ◽  
pp. 102253
Author(s):  
Alan Dinsdale ◽  
Alexandra Khvan ◽  
Ekaterina A. Smirnova ◽  
Alena V. Ponomareva ◽  
Igor A. Abrikosov
Keyword(s):  
Ab Initio ◽  
Thermodynamic Data ◽  
Calphad Approach ◽  
Zn Alloys

Combinatorial Electrodeposition of Ternary Cu–Sn–Zn Alloys

2005 ◽  
Vol 152 (8) ◽  
pp. C542 ◽  
Author(s):  
S. D. Beattie ◽  
J. R. Dahn
Keyword(s):  
Zn Alloys

scholarly journals Precipitate strengthening of pyramidal slip in Mg–Zn alloys

2021 ◽  
Vol 804 ◽  
pp. 140697
Author(s):  
Reza Alizadeh ◽  
Jingya Wang ◽  
Javier LLorca
Keyword(s):  
Pyramidal Slip ◽  
Precipitate Strengthening ◽  
Zn Alloys
Sign in / Sign up

Export Citation Format

Share Document