Reliability of thermal conductivity measurement of liquids by using transient hot-wire, photon-correlation spectroscopy and the laser flash method

2016 ◽  
Vol 68 (10) ◽  
pp. 1145-1155 ◽  
Author(s):  
Suyong Kwon ◽  
Joohyun Lee ◽  
Dae Ho Kim
2021 ◽  
Vol 39 (4) ◽  
pp. 402-408
Author(s):  
Da-In Lim ◽  
So-Jeong Lee ◽  
Seung-Boo Jung ◽  
Jun-Ki Kim

Epoxy adhesives, particularly for non-conductive pastes, are used in 3D chip-stack flip-chip packages to reinforce the mechanical strength of joints. Although the thickness of the adhesive layer is relatively small, its thermal conductivity is known to have a major effect on the heat dissipation behavior of chipstack packages. Because conventional thermal conductivity measurement methods such as the laser flash method are based on the bulk specimens having thicknesses greater than several mm, they are limited in their ability to measure the thermal conductivity of thin adhesive layers between silicon dies. In this study, a modified guarded hot-plate method is proposed using standard joint layer samples of known thermal conductivity, and the measurement results are compared with those of the laser flash method. Results showed that, based on a constant heat flux from heat source to heat sink, the temperature difference at both sides of the joint layers was proportional to the thermal resistivity of the joint layer materials. The thermal conductivity of the under-test joint layer could therefore be determined from the thermal conductivity spectrum of the known samples using a graphical method. Although the measured values by the modified guarded hot-plate method were slightly higher than those derived from the laser flash method due to the thickness effect, it was concluded that the modified guarded hot-plate method could be a practical method in measuring the thermal conductivity of thin adhesive joint layers.


Author(s):  
А.В. Асач ◽  
Г.Н. Исаченко ◽  
А.В. Новотельнова ◽  
В.Е. Фомин ◽  
К.Л. Самусевич ◽  
...  

The influence of the geometric shape of the samples on the uncertainty of the coefficient of thermal conductivity measurement of materials by the method of a laser flash has been studied. Using a method of mathematical modeling in the Comsol Multiphysics software, a model that simulates the process of measuring the coefficient of thermal conductivity of samples made of graphite, Mg2Si0.4Sn0.6 and bismuth telluride using a laser flash method has been created. Samples of cylindrical shape with plane-parallel sides and samples in the form of a truncated cylinder, as well as samples in the form of a parallelepiped with a square base, were investigated. It is shown that the measurement uncertainty of samples with plane-parallel sides and sizes up to 12.7 mm, does not exceed 2%. For samples in the form of a truncated cylinder with a diameter of 3 mm and at an angle of ϕ= 1.5°, the measurement uncertainty does not exceed 3%. With an increase in the sample diameter and the ϕ angle, the measurement uncertainty increases significantly.


1981 ◽  
Vol 20 (4) ◽  
pp. 333-336 ◽  
Author(s):  
Yutaka Tada ◽  
Makoto Harada ◽  
Masataka Tanigaki ◽  
Wataru Eguchi

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