Rapid thermal conductivity measurement of porous thermal insulation material by laser flash method

2016 ◽  
Vol 27 (3) ◽  
pp. 882-885 ◽  
Author(s):  
Tseng-Wen Lian ◽  
Akira Kondo ◽  
Megumi Akoshima ◽  
Haruka Abe ◽  
Takahiro Ohmura ◽  
...  
2021 ◽  
Vol 39 (4) ◽  
pp. 402-408
Author(s):  
Da-In Lim ◽  
So-Jeong Lee ◽  
Seung-Boo Jung ◽  
Jun-Ki Kim

Epoxy adhesives, particularly for non-conductive pastes, are used in 3D chip-stack flip-chip packages to reinforce the mechanical strength of joints. Although the thickness of the adhesive layer is relatively small, its thermal conductivity is known to have a major effect on the heat dissipation behavior of chipstack packages. Because conventional thermal conductivity measurement methods such as the laser flash method are based on the bulk specimens having thicknesses greater than several mm, they are limited in their ability to measure the thermal conductivity of thin adhesive layers between silicon dies. In this study, a modified guarded hot-plate method is proposed using standard joint layer samples of known thermal conductivity, and the measurement results are compared with those of the laser flash method. Results showed that, based on a constant heat flux from heat source to heat sink, the temperature difference at both sides of the joint layers was proportional to the thermal resistivity of the joint layer materials. The thermal conductivity of the under-test joint layer could therefore be determined from the thermal conductivity spectrum of the known samples using a graphical method. Although the measured values by the modified guarded hot-plate method were slightly higher than those derived from the laser flash method due to the thickness effect, it was concluded that the modified guarded hot-plate method could be a practical method in measuring the thermal conductivity of thin adhesive joint layers.


Author(s):  
А.В. Асач ◽  
Г.Н. Исаченко ◽  
А.В. Новотельнова ◽  
В.Е. Фомин ◽  
К.Л. Самусевич ◽  
...  

The influence of the geometric shape of the samples on the uncertainty of the coefficient of thermal conductivity measurement of materials by the method of a laser flash has been studied. Using a method of mathematical modeling in the Comsol Multiphysics software, a model that simulates the process of measuring the coefficient of thermal conductivity of samples made of graphite, Mg2Si0.4Sn0.6 and bismuth telluride using a laser flash method has been created. Samples of cylindrical shape with plane-parallel sides and samples in the form of a truncated cylinder, as well as samples in the form of a parallelepiped with a square base, were investigated. It is shown that the measurement uncertainty of samples with plane-parallel sides and sizes up to 12.7 mm, does not exceed 2%. For samples in the form of a truncated cylinder with a diameter of 3 mm and at an angle of ϕ= 1.5°, the measurement uncertainty does not exceed 3%. With an increase in the sample diameter and the ϕ angle, the measurement uncertainty increases significantly.


1981 ◽  
Vol 20 (4) ◽  
pp. 333-336 ◽  
Author(s):  
Yutaka Tada ◽  
Makoto Harada ◽  
Masataka Tanigaki ◽  
Wataru Eguchi

2014 ◽  
Vol 564 ◽  
pp. 315-320 ◽  
Author(s):  
Maatouk Khoukhi ◽  
Mahmoud Tahat

The impact of the thermal conductivity (k-value) change of polystyrene insulation material in building envelope due to changes in temperature on the thermal and energy performance of a typical residential building under hot climate is investigated. Indeed, the thermal and energy performance of buildings depends on the thermal characteristics of the building envelope, and particularly on the thermal resistance of the insulation material used. The thermal insulation material which is determined by its thermal conductivity, which describes the ability of heat to flow cross the material in presence of a gradient of temperature, is the main key to assess the performance of the thermal insulation material. When performing the energy analysis or calculating the cooling load for buildings, we use published values of thermal conductivity of insulation materials, which are normally evaluated at 24°C according to the ASTM standards. In reality, thermal insulation in building is exposed to significant and continuous temperature variations, due essentially to the change of outdoor air temperature and solar radiation. Many types of insulation materials are produced and used in Oman, but not enough information is available to evaluate their performance under the prevailing climatic condition. The main objective of this study is to investigate the relationship between the temperature and thermal conductivity of various densities of polystyrene, which is widely used as building insulation material in Oman. Moreover, the impact of thermal conductivity variation with temperature on the envelope-induced cooling load for a simple building model is discussed. This work will serve as a platform to investigate the effect of the operating temperature on thermal conductivity of other building material insulations, and leads to more accurate assessment of the thermal and energy performance of buildings in Oman.


2011 ◽  
Vol 250-253 ◽  
pp. 507-512
Author(s):  
Zi Sheng Wang ◽  
Hao Chi Tu ◽  
Jin Xiu Gao ◽  
Guo Dong Qian ◽  
Xian Ping Fan ◽  
...  

Aerogel is regarded as one kind of super thermal insulation materials which could be large-scalely used as building materials. However, the aerogel’s production cost and poor mechanical property limit the its applications. In this paper, we put forward a new low cost way to produce a novel building thermal insulation material: synthesized the aerogel within the expanded perlite’s pores, and using sodium silicate as precursor without adopting supercritical fluid drying and surface modification. The thermal conductivity of expanded perlite was successfully decreased after modified by aerogel.


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