Finite Element Modeling and Blister Test to Investigate the Adhesive Strength of Diamond Thin Film

Author(s):  
Dao Hui Xiang ◽  
Ming Chen ◽  
Fang Hong Sun
2007 ◽  
Vol 359-360 ◽  
pp. 85-89
Author(s):  
Dao Hui Xiang ◽  
Ming Chen ◽  
Fang Hong Sun

Large advancements have been achieved in understanding nucleation and growth of CVD diamond, but adhesion of diamond film to substrates is poor and there is no good methods about how to quantitative evaluation of the adhesive strength. The blister test is a method appropriate for measuring the adhesion of CVD diamond. In this test a pressure difference is applied across a thin film and the pressure when the film separates from substrate is measured, and the adhesive strength of diamond thin film was calculated using analytical model. Using the finite element model, the deflection at the center of a free-standing window sample of diamond thin films is calculated as a function of applied pressure and the adhesive strength is obtained using the FEM. The result indicates that finite element method-based prediction of the total energy release rate is in good agreement with that obtained from analytical expressions and experimentally observed values.


2020 ◽  
Vol 37 ◽  
pp. 1-8 ◽  
Author(s):  
Adnan Tahir ◽  
Guang-Rong Li ◽  
Mei-Jun Liu ◽  
Guan-Jun Yang ◽  
Cheng-Xin Li ◽  
...  

Solar Energy ◽  
2020 ◽  
Vol 209 ◽  
pp. 186-193
Author(s):  
Matthias Diethelm ◽  
Lieven Penninck ◽  
Markus Regnat ◽  
Ton Offermans ◽  
Birger Zimmermann ◽  
...  

2019 ◽  
Vol 5 (1) ◽  
Author(s):  
Surabhi Nimbalkar ◽  
Erwin Fuhrer ◽  
Pedro Silva ◽  
Tri Nguyen ◽  
Martin Sereno ◽  
...  

AbstractThe recent introduction of glassy carbon (GC) microstructures supported on flexible polymeric substrates has motivated the adoption of GC in a variety of implantable and wearable devices. Neural probes such as electrocorticography and penetrating shanks with GC microelectrode arrays used for neural signal recording and electrical stimulation are among the first beneficiaries of this technology. With the expected proliferation of these neural probes and potential clinical adoption, the magnetic resonance imaging (MRI) compatibility of GC microstructures needs to be established to help validate this potential in clinical settings. Here, we present GC microelectrodes and microstructures—fabricated through the carbon micro-electro-mechanical systems process and supported on flexible polymeric substrates—and carry out experimental measurements of induced vibrations, eddy currents, and artifacts. Through induced vibration, induced voltage, and MRI experiments and finite element modeling, we compared the performances of these GC microelectrodes against those of conventional thin-film platinum (Pt) microelectrodes and established that GC microelectrodes demonstrate superior magnetic resonance compatibility over standard metal thin-film microelectrodes. Specifically, we demonstrated that GC microelectrodes experienced no considerable vibration deflection amplitudes and minimal induced currents, while Pt microelectrodes had significantly larger currents. We also showed that because of their low magnetic susceptibility and lower conductivity, the GC microelectrodes caused almost no susceptibility shift artifacts and no eddy-current-induced artifacts compared to Pt microelectrodes. Taken together, the experimental, theoretical, and finite element modeling establish that GC microelectrodes exhibit significant MRI compatibility, hence demonstrating clear clinical advantages over current conventional thin-film materials, further opening avenues for wider adoption of GC microelectrodes in chronic clinical applications.


2007 ◽  
Vol 329 ◽  
pp. 551-556
Author(s):  
Xiao Gang Jian ◽  
L.D. Shi ◽  
Ming Chen ◽  
Fang Hong Sun

Adhesion properties of diamond thin films are essential to their performance in technical applications. To obtain the adhesive strength precisely and quantitatively has been the frontier issue to the related scientists and engineers. In this paper, a new experimental equipment for blister tests was designed purposely and fabricated considering related influencing facts. A free-standing window of diamond thin film with the support of silicon wafer was obtained by the aid of photolithography and anisotropic wet etching technology so as to improve the precision of quantitative adhesion measures of diamond films. The mechanics for calculating the quantitative driving force of blister-induced delamination of diamond thin film is presented, which is on base of intensive modeling and simulation. The laser interferometer measurement with fine solution was used to pick up dynamic signals of diamond thin film bulge deformation in micrometer scale and the relationship demonstration of stress to strain of the diamond thin film was available, as a consequence, the adhesive strength could be obtained precisely and quantitatively by the valid model. The paper confirms the accessibility to precise quantitative adhesion measures of diamond films and the results will be beneficial to wide application of diamond thin films in the related fields.


1999 ◽  
Vol 593 ◽  
Author(s):  
P.J. Wolff ◽  
B.N. Lucas ◽  
E.G. Herbert

ABSTRACTA commonly used technique to compute mechanical properties from indentation tests is the Oliver and Pharr method. Using dimensional analysis and finite element modeling, this paper investigates errors when the Oliver and Pharr method is used to compute thin film properties.


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