Vibration Fatigue Analysis of the Solder Connector

2011 ◽  
Vol 105-107 ◽  
pp. 294-298
Author(s):  
Xiao Xi Guo ◽  
Chuan Ri Li ◽  
Long Tao Liu

With the increasing problems of fatigue failure of PCB in aeronautic and astronautic electronic chassis, the paper proposes a life prediction method of the solder connector based on physics of failure by simulation and physical test. The virtual modal and random vibration response of the box should be solved by finite element method in the ANSYS software, and these results have been verified by modal test and random vibration test. While the structure parameter and the environment stress of the box, the results of the simulation as the input of the vibration fatigue physics of failure model, the life of solder connector could be computed. There is a comparison between results from the CalcePWA software and it from physics of failure model and simulation.

2015 ◽  
Vol 2015 ◽  
pp. 1-13 ◽  
Author(s):  
Yu Jiang ◽  
Gun Jin Yun ◽  
Li Zhao ◽  
Junyong Tao

Novel accelerated random vibration fatigue test methodology and strategy are proposed, which can generate a design of the experimental test plan significantly reducing the test time and the sample size. Based on theoretical analysis and fatigue damage model, several groups of random vibration fatigue tests were designed and conducted with the aim of investigating effects of both Gaussian and non-Gaussian random excitation on the vibration fatigue. First, stress responses at a weak point of a notched specimen structure were measured under different base random excitations. According to the measured stress responses, the structural fatigue lives corresponding to the different vibrational excitations were predicted by using the WAFO simulation technique. Second, a couple of destructive vibration fatigue tests were carried out to validate the accuracy of the WAFO fatigue life prediction method. After applying the proposed experimental and numerical simulation methods, various factors that affect the vibration fatigue life of structures were systematically studied, including root mean squares of acceleration, power spectral density, power spectral bandwidth, and kurtosis. The feasibility of WAFO for non-Gaussian vibration fatigue life prediction and the use of non-Gaussian vibration excitation for accelerated fatigue testing were experimentally verified.


2012 ◽  
Vol 548 ◽  
pp. 521-526 ◽  
Author(s):  
Xing Hao Wang ◽  
Jiang Shao ◽  
Xiao Yu Liu

Different from the reliability prediction method on handbook, the reliability prediction method based on Physics of Failure (PoF) model takes failure mechanism as theoretical basis, and combines the design in-formation with the environment stress of the product to predict the time to failure. When the uncertain of the parameters is considered to predict the reliability, Monte-Carlo calculation method is always used here. How-ever, the Monte-Carlo method needs large computational cost, especially for large and complicated electronic systems. A new reliability prediction method which combines the first order reliability with the reliability pre-diction method based on PoF model was proposed. The new method utilized the first order method to calculate the position of design point and reliability index, thus Monte-Carlo calculation process was avoided. Example calculation results showed that the new method improves the prediction efficiency without decreasing the accuracy of reliability, thus it is feasible for reliability prediction of electronic product in engineering.


Mechatronics ◽  
2013 ◽  
Vol 23 (8) ◽  
pp. 1202-1214 ◽  
Author(s):  
Xin Fang ◽  
Jinyong Yao ◽  
Xizhong Yin ◽  
Xun Chen ◽  
Chunhua Zhang

2000 ◽  
Author(s):  
T. E. Wong ◽  
F. W. Palmieri ◽  
L. A. Kachatorian

Abstract A newly developed methodology is used to support test validation of ball grid array (BGA) solder joint vibration fatigue life prediction model. This model is evolved from an empirical formula of universal slopes, which is derived from high-cycle fatigue test data using a curve fitting technique over 29 different materials of metals. To develop the BGA solder joint vibration fatigue life prediction model, a test vehicles (TV), on which various sizes of BGA daisy-chained packages are soldered, is first designed, fabricated and subjected to random vibration tests with continuously monitoring the solder joint integrity. Based on the measurement results, a destructive physical analysis is then conducted to further verify the failure locations and crack paths of the solder joints. Next, a method to determine the stresses/strains of BGA solder joints resulting from exposure of the TV to random vibration environments is developed. In this method, a 3-D modeling technique is used to simulate the vibration responses of the BGA packages. Linear static and dynamic finite element analyses with MSC/NASTRAN™ computer code, combined with a volume-weighted average technique, are conducted to calculate the effective strains of the solder joints. In the calculation process, several in-house developed Fortran programs, in conjunction with the outputs obtained from MSC/NASTRAN™ static and frequency response analyses, are used to perform the required computations. Finally, a vibration fatigue life model is established with two unknown parameters, which can be determined by correlating the derived solder effective strains to the test data. This test-calibrated model is then recommended to serve as an effective tool to determine the integrity of the BGA solder joints during vibration. Selecting more study cases with various package sizes, solder ball configurations, vibration profiles to further calibrate this model is also recommended. An example of a 313-pin plastic and 304-pin ceramic BGAs is illustrated in the present study.


Author(s):  
Yu Zang ◽  
Wei Shangguan ◽  
Baigen Cai ◽  
Huasheng Wang ◽  
Michael. G. Pecht

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