Thermal Design of a Satellite Borne FPGA

2011 ◽  
Vol 52-54 ◽  
pp. 1411-1414 ◽  
Author(s):  
Bo Chen
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Heat Sink ◽  
Thermal Design ◽  
Junction Temperature ◽  
Element Analysis

Thermal design and analysis of a satellite borne FPGA is described in this paper. Thermal-conductive glue, vias and an aluminum bar were used to the FPGA and the PCB under the FPGA in order to help conduct the heat of the FPGA to heat sink. The results of finite element analysis showed that the case temperature of the FPGA decreased from 132.5°C to 55.4°C and the junction temperature decreased from 136.1°C to59.0 °C after the thermal design, which matches the requirements of thermal design.

Phase Change Materials Applied in Thermal Design

2013 ◽  
Vol 750-752 ◽  
pp. 1211-1214
Author(s):  
Shu Yang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Solar Energy ◽  
Phase Change ◽  
Phase Change Material ◽  
Phase Change Materials ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Element Analysis ◽  
Change Material

Phase change material has been widely used in the fields of solar energy, aerospace, aviation, and buildings. In this paper, paraffin is applied in the thermal design of electronic equipment, in order to maintain a constant working circumstance. Finite-element analysis is implemented to analyze the feasibility of this thermal design.

Finite Element Analysis and Die Design of Extrusion Processes of Radial-Finned Heat Sink

2011 ◽  
Vol 264-265 ◽  
pp. 30-35
Author(s):  
Dyi Cheng Chen ◽  
Jhih Ming Chen ◽  
Ming Wei Guo ◽  
Chih Hsuan Jao ◽  
Wen Jong Chen
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Heat Sink ◽  
Extrusion Process ◽  
Die Design ◽  
Element Analysis ◽  
Extrusion Die ◽  
Different Types ◽  
Finite Element Package ◽  
Manufacturing Methods

There are many different types of manufacturing methods for heat sink fins in the current market. The aim of this study is to design an extrusion die for a radial-finned heat sink using a commercial finite element package, DEFORMTM 3D. We then conduct a series of simulation analyses with different variables such as friction factor, ram velocity, and fin gate stage of the die to evaluate the methods of decreasing the warping in the extrusion process. The die is assumed as a rigid body in the analyses. The results confirm the suitability of DEFORMTM 3D to design an extrusion die achieving a lower warping behavior of the radial-finned heat sink.

Thermal Design and Analysis of a Satellite Borne Electronic PCB

2011 ◽  
Vol 199-200 ◽  
pp. 1551-1554 ◽  
Author(s):  
Bo Chen
Keyword(s):  
Thermal Analysis ◽  
Finite Element Analysis ◽  
Finite Element ◽  
High Temperature ◽  
Thermal Design ◽  
Element Analysis ◽  
Main Structure ◽  
Computing Model ◽  
Temperature Work

Thermal design, finite element analysis of a satellite borne PCB is introduced in this paper. Some methods were adopted to help heat conduct and a simplified computing model was built. The analysis results show that the temperature scope of the main structure is from 45.5°C to 72.3°C in high temperature work case and all of junction temperatures of components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis.

Finite element analysis on dental implant[ndash ]supported prostheses without passive fit

2002 ◽  
Vol 11 (1) ◽  
pp. 30-40 ◽  
Author(s):  
Chatchai Kunavisarut ◽  
Lisa A. Lang ◽  
Brian R. Stoner ◽  
David A. Felton
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Dental Implant ◽  
Element Analysis ◽  
Passive Fit
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