Electrical Characterization of Inductively Coupled Plasma Reactor Excited by RF (13.56MHz)

In the surface treatment by plasma, the saturation ion current is the macroscopic parameter which can give us information on the ionic density in plasma. For this, we followed the evolution of the saturation ion current versus the pressure and power. Our experimental setup consists of spherical plasma reactor linked with inductively source argon plasma and probe to measure ionic current. The obtained experimental results enabled us to highlight the effect of pressure and power on saturation ion current. We found in this study that the saturation ion current increases with pressure and presents an optimum depending on the power.

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TRANSITION BETWEEN E-MODE AND H-MODE IN A CYLINDRICAL INDUCTIVELY COUPLED PLASMA REACTOR

High Temperature Material Processes An International Quarterly of High-Technology Plasma Processes ◽

10.1615/hightempmatproc.v14.i1-2.100 ◽

2010 ◽

Vol 14 (1-2) ◽

pp. 119-127 ◽

Cited By ~ 1

Author(s):

F. Croccolo ◽

A. Quintini ◽

R. Barni ◽

C. Riccardi

Keyword(s):

Inductively Coupled Plasma ◽

Plasma Reactor ◽

Inductively Coupled ◽

Inductively Coupled Plasma Reactor

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Self-sustained secondary discharge in inductively coupled plasma reactor

Applied Physics Letters ◽

10.1063/1.126391 ◽

2000 ◽

Vol 76 (18) ◽

pp. 2508-2510

Author(s):

Joachim Walewski ◽

Jussi Larjo ◽

Rolf Hernberg

Keyword(s):

Inductively Coupled Plasma ◽

Plasma Reactor ◽

Inductively Coupled ◽

Inductively Coupled Plasma Reactor

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Growth of multiwall carbon nanotubes in an inductively coupled plasma reactor

Journal of Applied Physics ◽

10.1063/1.1465101 ◽

2002 ◽

Vol 91 (9) ◽

pp. 6027-6033 ◽

Cited By ~ 179

Author(s):

Lance Delzeit ◽

Ian McAninch ◽

Brett A. Cruden ◽

David Hash ◽

Bin Chen ◽

...

Keyword(s):

Carbon Nanotubes ◽

Inductively Coupled Plasma ◽

Plasma Reactor ◽

Multiwall Carbon Nanotubes ◽

Inductively Coupled ◽

Inductively Coupled Plasma Reactor ◽

Multiwall Carbon

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Flow and temperature patterns in an inductively coupled plasma reactor: Experimental measurements and CFD simulations

AIChE Journal ◽

10.1002/aic.14547 ◽

2014 ◽

Vol 60 (10) ◽

pp. 3647-3664 ◽

Cited By ~ 5

Author(s):

Sangeeta B. Punjabi ◽

Sunil N. Sahasrabudhe ◽

S. Ghorui ◽

A. K. Das ◽

Narendra K. Joshi ◽

...

Keyword(s):

Inductively Coupled Plasma ◽

Plasma Reactor ◽

Experimental Measurements ◽

Cfd Simulations ◽

Inductively Coupled ◽

Inductively Coupled Plasma Reactor

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Designing Ultra Low-k Dielectric Materials for Ease of Patterning

MRS Proceedings ◽

10.1557/proc-1249-f04-15 ◽

2010 ◽

Vol 1249 ◽

Cited By ~ 3

Author(s):

George Andrew Antonelli ◽

Gengwei Jiang ◽

Mandyam Sriram ◽

Kaushik Chattopadhyay ◽

Wei Guo ◽

...

Keyword(s):

Inductively Coupled Plasma ◽

Ion Beam ◽

Plasma Reactor ◽

Dielectric Materials ◽

Dielectric Constants ◽

Interlayer Dielectric ◽

Inductively Coupled ◽

Inductively Coupled Plasma Reactor ◽

Low K

AbstractOrganosilicate materials with dielectric constants (k) ranging from 3.0 to 2.2 are in production or under development for use as interlayer dielectric materials in advanced interconnect logic technology. The dielectric constant of these materials is lowered through the addition of porosity which lowers the film density, making the patterning of these materials difficult. The etching kinetics and surface roughening of a series of low-k dielectric materials with varying porosity and composition were investigated as a function of ion beam angle in a 7% C4F8/Ar chemistry in an inductively-coupled plasma reactor. A similar set of low-k samples were patterned in a single damascene scheme. With a basic understanding of the etching process, we will show that it is possible to proactively design a low-k material that is optimized for a given patterning. A case study will be used to illustrate this point.

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