3D-Simulation of Void Formation, Growth and Migration under Electromigration
2005 ◽
Vol 237-240
◽
pp. 1306-1311
Keyword(s):
The 3D Monte Carlo scheme is proposed for simulation of simultaneous self-consistent current redistribution, surface diffusion, drift and void migration and coalescence at the interface metal/dielectric. Results of simulation as well as simple phenomenological model demonstrate a possibility of trapping at and migration along the grainboundaries (GBs). Critical size of “detrapping” after coalescence has been estimated.
2008 ◽
Vol 7
(3)
◽
pp. 201-204
◽
Keyword(s):
2012 ◽
Vol 11
(03)
◽
pp. 1242006
◽
Keyword(s):
1992 ◽
Vol 97
(2)
◽
pp. 1455-1464
◽
Keyword(s):