Modelling of Solid-State Diffusion Bonding with a Real Rough Surface

By using the real information of the intended bonding surface and considering the effect of the diffusion distance in a definite time, a new theoretical model for diffusion bonding was proposed. The model, reflecting the characteristic of real bonding process effectively, realizes the visualization and simulation of the bonding process in which many voids disappear dynamically. The results show that the simulation is close to those experimental results from the phenomena of voids closure.

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Algorithm for Estimating Bonding Process Variation by Applying Statistical Analysis. Support System for Prediction of Solid State Diffusion Bonding (Part 3).

QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY ◽

10.2207/qjjws.14.682 ◽

1996 ◽

Vol 14 (4) ◽

pp. 682-688

Author(s):

Yasuo Takahashi ◽

Hiroshi Tsunekuni ◽

Yoshiharu Sanagawa ◽

Katsunori Inoue ◽

Kimiyuki Nishiguchi

Keyword(s):

Statistical Analysis ◽

Solid State ◽

Support System ◽

Diffusion Bonding ◽

Process Variation ◽

Bonding Process ◽

Solid State Diffusion ◽

State Diffusion

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Solid State Diffusion Bonding Process-A Review

IOP Conference Series Materials Science and Engineering ◽

10.1088/1757-899x/1013/1/012011 ◽

2021 ◽

Vol 1013 ◽

pp. 012011

Author(s):

T Aravinda ◽

H B Niranjan ◽

B Satish Babu ◽

M Udaya Ravi

Keyword(s):

Solid State ◽

Diffusion Bonding ◽

Bonding Process ◽

Solid State Diffusion ◽

State Diffusion

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Joining of Gamma-Based Titanium Aluminides – A Review

Materials Science Forum ◽

10.4028/www.scientific.net/msf.514-516.483 ◽

2006 ◽

Vol 514-516 ◽

pp. 483-489 ◽

Cited By ~ 4

Author(s):

Ana Sofia Ramos ◽

M. Teresa Vieira ◽

Manuel F. Vieira ◽

Filomena Viana

Keyword(s):

Solid State ◽

Diffusion Bonding ◽

Titanium Aluminides ◽

Physical And Mechanical Properties ◽

Bonding Process ◽

Advanced Materials ◽

Solid State Diffusion ◽

Tial Alloys ◽

Novel Approach ◽

State Diffusion

The optimisation of joining technologies is essential to the application of advanced materials in the design of parts and devices. The development of intermetallic compounds, as structural materials, inevitably requires a new approach to join these compounds to themselves or to other materials. Among different intermetallic classes, titanium aluminides are one of the most studied. However, the industrial application is far from being proportional to the research, due to different problems, where joining processes have an important role. The present paper highlights the state of art on joining γ-TiAl alloys. A review is presented with special emphasis on solid-state diffusion bonding process, because it seems to be the most suitable technique to produce high quality joints of advanced materials. The influence of the bonding conditions on the physical and mechanical properties of the joints is highlighted and the introduction of single or multiple interlayers to assist in the bonding process is discussed. A novel approach developed by the authors to the solid-state diffusion bonding of γ-TiAl alloys using Ti/Al multilayer thin films as bonding materials is proposed. The improvement of the solid-state diffusion bonding will induce sound joints at lower temperatures or pressures.

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