Low temperature solid-state-diffusion bonding for fine-pitch Cu/Sn/Cu interconnect

2015 ◽  
Author(s):  
Jian Cai ◽  
Junqiang Wang ◽  
Qian Wang ◽  
Ziyu Liu ◽  
Dejun Wang ◽  
...  
Keyword(s):  
Solid State ◽  
Low Temperature ◽  
Diffusion Bonding ◽  
Solid State Diffusion ◽  
Fine Pitch ◽  
State Diffusion ◽  
Cu Interconnect

Laser properties of Fe2+:ZnSe fabricated by solid-state diffusion bonding

2018 ◽  
Vol 15 (4) ◽  
pp. 045806 ◽  
Author(s):  
S S Balabanov ◽  
K N Firsov ◽  
E M Gavrishchuk ◽  
V B Ikonnikov ◽  
S Yu Kazantsev ◽  
...  
Keyword(s):  
Solid State ◽  
Diffusion Bonding ◽  
Solid State Diffusion ◽  
State Diffusion
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