Fabrication of Al6061-AMC by Adding Copper-Coated SiC Reinforcement by Friction Stir Processing (FSP)

Friction stir processing (FSP) has successfully evolved as a technique in fabricating surface composite. An alternative technique on fabrication of a SiC-reinforced Al6061 aluminum matrix composite (AMC) by stirring copper-coated SiC particles into matrix to form a reinforced zone was developed. Copper film was deposited onto the SiC particles by electroless plating and by photodeposition processes. The copper coating serves as an adhesion and diffusion layer to enhance the cohesion between the particles and the matrix. It is to expect that the strength of the AMC could be improved. The uniformity of particle distribution in the stir zone (SZ) was improved by adjusting the location of particle insert and by a double-pass stir. T5 post weld heat treatment (PWHT) was conducted to retrieve the hardness and the strength of the SZ to the strength level of the matrix. While the submicron-thick Cu-coating was partially separated from SiC particles after FSP, photodeposition Cu-coating less than 100 nm thick exhibited a better adhesion to the SiC particles. The EPMA analysis across the interface shows evidence of interdiffusion between copper and aluminum which implies an enhanced cohesion between the particles and matrix. After PWHT, while the SZ containing photodeposition Cu-coated SiC exhibited the highest hardness among different SZs, the SZ containing electroless Cu-coated SiC exhibited the highest strength. The possible mechanisms for the improvement of the hardness and strength were discussed. In summary, the purpose of fabricating a locally particulate-reinforced Al6061 AMC by stirring Cu-coated SiC particles into Al6061 matrix was achieved. Keywords:Friction stir processing (FSP), particulate reinforced AMC, electroless plating, photodeposition, copper-coated SiC particles