Molecular-dynamics study of multi-pulsed ultrafast laser interaction with copper

Ultrafast laser has an undeniable advantage in laser processing due to its extremely small pulse width and high peak energy. While the interaction of ultrafast laser and solid materials is an extremely non-equilibrium process in which the material undergoes phase transformation and even ablation in an extremely short time range. This is the coupling of the thermos elastic effect caused by the pressure wave and the superheated melting of the material lattice. To further explore the mechanism of the action of ultrafast laser and metal materials, the two-temperature model coupling with molecular dynamics method was used to simulate the interaction of the copper and laser energy. Firstly, the interaction of single-pulsed laser and copper film was reproduced, and the calculated two-temperature curve and the visualized atomic snapshots were used to investigate the influence of laser parameters on the ablation result. Then, by changing the size of the atomic system, the curve of ablation depth as a function of laser fluence was obtained. In this paper, the interaction of multi-pulsed laser and copper was calculated. Two-temperature curve and temperature contour of copper film after the irradiation of double-pulsed and multi-pulsed laser were obtained. And the factors which can make a difference to the incubation effect were analyzed. By calculating the ablation depth under the action of multi-pulsed laser, the influence of the incubation effect on ablation results was further explored. Finally, a more accurate numerical model of laser machining metal is established and verified by an ultra-short laser processing experiment, which provides a new calculation method and theoretical basis for ultra-fast laser machining of air film holes in aviation turbine blades, and has certain practical guiding significance for laser machining.

A Study on the Control of Residual Stress of Copper Thick-Film Using 2D Nanomaterial

With the rapid development of the electronics industry, high-density electronic devices and component mounting have gained popularity. Because of the heat generated from these devices, efficiency of the electronic parts is significantly lowered and life of various electronic devices is considerably shortened. Therefore, it is essential to efficiently dissipate the heat generated from the device to extend product life and ensure high efficiency of electronic components. This study evaluated how residual stress is impacted by the thickness of the deposited copper film, which is widely used as a heat dissipation material, and the number of graphene layers. The results confirmed that the residual stress decreased with increasing thickness. Moreover, the residual stress changed based on the transfer area of graphene, which had an elastic modulus eight times that of copper, indicating that the residual stress of the deposited copper film can be controlled.

Deposition of GaN nanoparticles on the surface of a copper film under the action of electrostatic field during the femtosecond laser ablation synthesis in ammonia environment

In this article, we show the possibility for obtaining and deposition of gallium nitride nanoparticles under the action of femtosecond laser radiation. Using the developed setup for thermal vacuum deposition of copper on silicon plates, we obtained the thin-film substrates following by the deposition of gallium nitride on them. The gallium nitride was formed by applying the femtosecond laser radiation to the gallium targets in ammonia medium. The controlled collection of ablation products following by their removal from the processing area by means of electrostatic field was used in the setup in order to efficiently collect gallium nitride nanoparticles. The formation of gallium nitride nanoparticles is verified by the results of X-ray diffraction analysis.

Calculation and experimental analysis of heat transfer of assemblies of ribbed heat exchange elements

The results of thermal-hydraulic and strength tests of finned tube assemblies welded from KP 20 elements of four sizes are presented. The elements are representing by steel plate 0.4 mm in thickness, covered with a copper film 0.025 mm in thickness. One or two conical necks 17 mm long are extended in the plates. A set of placed in each other cones form a welded finned tube 23/20 mm with a toothed inner surface. As a result of the tests: high strength characteristics of these assemblies were demonstrated (internal pressure of burst under normal conditions is 40 MPa, resistance to sudden changes in temperature and freezing of water in “pipes”); a high average coefficient of thermal conductivity in the thickness of the ribs was confirmed at the level of 75 W/(m×K); the increase in the intensity of the heat transfer process is 2.15 times with the help of technological protrusions on the inner surface of the “pipe” to a turbulent single-phase flow in comparison with the calculated values for “smooth” pipes with a moderate increase in hydraulic resistance; the method of heat-hydraulic calculation of heat exchangers consisting of such “pipes” is proposed. The method is based on the ratios set out in the regulatory document “RD 24.035.05-89”. Thermal and hydraulic calculation of NPP heat exchanging equipment”, with amendments considering the high degree of finning of the tested “pipes” and the asymmetry of the edges of the ribs relative to the axis of the “pipes” bearing pressure, as well as the change in the value of the correction for the smallness of the tube bundle — we also identified areas of effective use of assemblies tested sizes of elements KP 20.