Testing of the Mars Exploration Rovers to Survive the Extreme Thermal Environments

2007 ◽  
Vol 4 (4) ◽  
pp. 145-154
Author(s):  
Kin F. Man ◽  
Alan R. Hoffman

NASA's Mars Exploration Rover (MER) project involved delivering two mobile science laboratories (rovers) on the surface of Mars to remotely conduct geologic investigations, including characterization of a diversity of rocks and soils. The rovers were launched separately in 2003 and have been in operation on the surface of Mars since January 2004. The rovers underwent a comprehensive pre-launch environmental assurance program that included assembly/subsystem and system-level testing in the areas of dynamics, thermal, and electromagnetic (EMC), as well as venting/pressure, dust, radiation, and solid-particle (meteoroid, orbital debris) analyses. Due to the Martian diurnal cycles of extreme temperature swings, the susceptible hardware that were mounted outside of the thermal controlled zones also underwent thermal cycling qualification of their packaging designs and manufacturing processes. This paper summarizes the environmental assurance program for the MER project, with emphasis on the pre-launch thermal testing program for ensuring that the rover hardware would operate and survive the Mars surface temperature extremes. These test temperatures are compared with some of the Mars surface operational temperature measurements. Selected anomalies resulting from operating the rover hardware in the Mars extreme thermal environment are also presented.

2014 ◽  
Vol 778-780 ◽  
pp. 681-684 ◽  
Author(s):  
Katarina Smedfors ◽  
Luigia Lanni ◽  
Mikael Östling ◽  
Carl Mikael Zetterling

Extreme temperature measurements of Ni/Ti/Al contacts to p-type SiC (Na= 1∙1018cm-3), with a specific contact resistivity ρc= 6.75∙10-4Ωcm2at 25 °C, showed a five time increase of the specific contact resistivity at -40 °C (ρc= 3.16∙10-3Ωcm2), and a reduction by almost a factor 10 at 500 °C (ρc= 7.49∙10-5Ωcm2). The same response of ρcto temperature was seen for contacts on lower doped epitaxial layer. Also N-type nickel contacts improved with higher operational temperature but with a considerably smaller variation over the same temperature interval. No degradation of the performance was seen to either the Ni/Ti/Al or the Ni contacts due to the high temperature measurements.


2015 ◽  
Vol 821-823 ◽  
pp. 781-784 ◽  
Author(s):  
Philip G. Neudeck ◽  
Liang Yu Chen ◽  
David J. Spry ◽  
Glenn M. Beheim ◽  
Carl W. Chang

This work reports DC electrical characterization of a 76 mm diameter 4H-SiC JFET test wafer fabricated as part of NASA’s on-going efforts to realize medium-scale ICs with prolonged and stable circuit operation at temperatures as high as 500 °C. In particular, these measurements provide quantitative parameter ranges for use in JFET IC design and simulation. Larger than expected parameter variations were observed both as a function of position across the wafer as well as a function of ambient testing temperature from 23 °C to 500 °C.


2000 ◽  
Vol 39 (17) ◽  
pp. 2941 ◽  
Author(s):  
Patrick Naulleau ◽  
Kenneth A. Goldberg ◽  
Eric M. Gullikson ◽  
Jeffrey Bokor

2022 ◽  
Vol 10 (1) ◽  
pp. 1-9
Author(s):  
Nágela Maria Henrique Mascarenhas ◽  
Dermeval Araújo Furtado ◽  
Bonifácio Benício de Souza ◽  
Airton Gonçalves de Oliveira ◽  
Antonio Nelson Lima da Costa ◽  
...  

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