scholarly journals Fabrication of Copper Microparticles by Copper Deposition and Dissolution in Copper Sulfate Bath for Micropored PVD Hard Coating

2012 ◽  
Vol 63 (4) ◽  
pp. 259 ◽  
Author(s):  
Ken-ichi MIURA ◽  
Tsutomu MORIKAWA ◽  
Masayuki YOKOI
Keyword(s):  
Copper Sulfate ◽  
Copper Deposition ◽  
Hard Coating ◽  
Sulfate Bath

scholarly journals Visualization of Latent Fingerprints on Aluminum

2019 ◽  
Vol 73 (11) ◽  
pp. 945-946
Author(s):  
Rachel Fischer ◽  
Marco Oetken
Keyword(s):  
Corrosion Inhibitor ◽  
Copper Sulfate ◽  
Direct Contact ◽  
Sulfate Solution ◽  
Copper Deposition ◽  
Decisive Factor ◽  
Visualization Method ◽  
Latent Fingerprints ◽  
Copper Sulfate Solution ◽  
Negative Image

For aluminum, a new visualization method is presented in which copper is deposited electrochemically. The fingerprint on the aluminum (trace carrier) serves as an insulator as it prevents direct contact between electrolyte and aluminum. The decisive factor is the choice of an ammoniacal copper sulfate solution, which acts as a corrosion inhibitor due to the ammonia molecules. This enables uniform copper deposition on aluminum and thus the development of a clearly defined negative image.

Copper deposition on textiles via an automated dispensing process for flexible microstrip antennas

2014 ◽  
Vol 84 (19) ◽  
pp. 2026-2035 ◽  
Author(s):  
Bing Li ◽  
Dapeng Li ◽  
Jiping Wang
Keyword(s):  
Copper Sulfate ◽  
Copper Deposit ◽  
Sulfate Solution ◽  
Microstrip Antennas ◽  
Driving Pressure ◽  
Copper Deposition ◽  
Electrical Performance ◽  
Complexing Agent ◽  
Patch Antennas ◽  
Copper Sulfate Solution

A three-axis automatic robot was coupled with a precision liquid dispenser to deposit copper on fabrics to be used as the conductive layer for assembly of textile-based flexible microstrip patch antennas. Two reactive solutions, copper sulfate and sodium borohydride, were sequentially dispensed on fabrics and a conductive copper was produced in situ and in real time, through a simple redox mechanism. Driving pressure, the number of dispensing cycles, concentration and composition (i.e. the addition of a complexing agent sodium citrate to the copper sulfate solution) of the reactive solutions were studied to optimize the dispensing process in favor of rapid copper deposition. The electrical performance of the resulting copper deposit and its adhesion to the textile substrates were characterized. A copper coating of about 0.2 ohm/□ sheet resistance could be prepared in less than 1 hour under a 45 kPa driving pressure, at a 200 mm·s−1 moving speed, and within 60 dispensing cycles.

Pathological Study of Effect of Short and Long-term Copper Sulfate Bath on Gill in Grass Carp, Ctenopharyngodon idella

2007 ◽  
Vol 20 (1) ◽  
Author(s):  
R. PEYGHAN ◽  
K. OSKOIIZADEH ◽  
S. ESMAILZADEH ◽  
A. RASEKH
Keyword(s):  
Copper Sulfate ◽  
Grass Carp ◽  
Ctenopharyngodon Idella ◽  
Sulfate Bath ◽  
Secondary Lamellae ◽  
Cellular Debris ◽  
Sulfate Baths ◽  
Grass Carp Ctenopharyngodon Idella ◽  
Short And Long Term

Grass carp were exposed to two therapeutic concentrations of copper sulfate (10 mgxL-1 in 1 hour and 1 mgxL-1 in 24 hours). Twenty-four hours after the copper sulfate baths, the histopathology of the gills was studied. The observed lesions in gills after short and long term baths were: mucus coagulation and accumulation of cellular debris on the epithelium of lamellae and inter lamellar regions, lamellar edema, hemorrhage, hyperplasia, epithelial cell necrosis, congestion and aneurysm (telangiectasis) in the secondary lamellae. In the 24 hour copper sulfate bath, the percentage of gill lesions that were observed correlated directly with the copper sulfate concentration (p0.05). Epithelial necrosis (89% in 10 mgxL-1 for 1 h) was the most prevalent lesion in these groups.

scholarly journals Development of Anode Slime Free-System for Copper Plating Using Acid Copper Sulfate Bath.

2001 ◽  
Vol 52 (2) ◽  
pp. 212-216 ◽  
Author(s):  
Masayuki YOKOI ◽  
Takuo NAKADE ◽  
Tsutomu MORIKAWA ◽  
Susumu YUYA
Keyword(s):  
Copper Sulfate ◽  
Anode Slime ◽  
Copper Plating ◽  
Free System ◽  
Sulfate Bath
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