Transient liquid-phase sintering using silver and tin powder mixture for die bonding

2016 ◽  
Vol 55 (4S) ◽  
pp. 04EC14 ◽  
Author(s):  
Masahisa Fujino ◽  
Hirozumi Narusawa ◽  
Yuzuru Kuramochi ◽  
Eiji Higurashi ◽  
Tadatomo Suga ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Powder Mixture ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Die Bonding ◽  
Transient Liquid Phase Sintering

Transient Liquid-Phase Sintering using Tin and Silver Powder Mixture for Die Bonding

2015 ◽  
Author(s):  
M. Fujino ◽  
H. Narusawa ◽  
Y. Kuramochi ◽  
E. Higurashi ◽  
T. Suga ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Powder Mixture ◽  
Silver Powder ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Die Bonding ◽  
Transient Liquid Phase Sintering

Transient Liquid Phase Sintering of Ni-Cu

1983 ◽  
Vol 74 (11) ◽  
pp. 737-743
Author(s):  
Franz J. Puckert ◽  
Wolfgang A. Kaysser ◽  
Günter Petzow
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Transient Liquid Phase Sintering

Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging

2015 ◽  
Vol 2015 (1) ◽  
pp. 000449-000452 ◽  
Author(s):  
Xiangdong Liu ◽  
Hiroshi Nishikawa
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Liquid Phase ◽  
Applied Pressure ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Thermally Stable ◽  
Bonding System ◽  
Cu Substrates ◽  
Transient Liquid Phase Sintering

We develop a transient liquid phase sinter (TLPS) bonding using Sn-coated Cu micro-sized particles. With this bonding process, a thermally stable joint comprising Cu3Sn phase and a dispersion of ductile Cu particles can be obtained. The particle paste, which contained Cu particles with a thin Sn coating and terpineol, was used to join Cu substrates. The setup was bonded at 300 °C for 30s under an applied pressure of 10 MPa using a thermo-compression bonding system under a formic acid gas atmosphere for reducing the oxide layer on the Sn coating and the Cu substrate. After bonding, the TLPS joint showed a thermally stable microstructure with a good shear strength, which was fully consisted of Cu3Sn intermetallic compounds matrix and embedded ductile Cu particles. The kinetics of the microstructure transformation and high temperature reliability of the TLPS joint were investigated. After 300 °C isothermal aging for 200h, the shear strength and microstructure of the TLPS joints showed almost unchanged. The results demonstrate that joint with high-melting-point obtained by the TLPS bonding using Sn-coated Cu particle paste has the potential to fulfill the requirement of high temperature electronic packaging.

Investigation of microstructural evolution and electrical properties for Ni-Sn transient liquid-phase sintering bonding

2017 ◽  
Vol 13 (6) ◽  
pp. 489-496 ◽  
Author(s):  
Hong-Liang Feng ◽  
Ji-Hua Huang ◽  
Jian Yang ◽  
Shao-Kun Zhou ◽  
Rong Zhang ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Electrical Properties ◽  
Microstructural Evolution ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Transient Liquid Phase Sintering

Improving the dry sliding-wear resistance of B4C ceramics by transient liquid-phase sintering

2020 ◽  
Vol 40 (15) ◽  
pp. 5286-5292 ◽  
Author(s):  
Cristina Ojalvo ◽  
Estíbaliz Sánchez-González ◽  
Fernando Guiberteau ◽  
Oscar Borrero-López ◽  
Angel L. Ortiz
Keyword(s):  
Wear Resistance ◽  
Liquid Phase ◽  
Sliding Wear ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Dry Sliding Wear ◽  
Dry Sliding ◽  
Transient Liquid Phase Sintering

Transient Liquid Phase Sintering of Silicon Nitride by Hafnia Addition

1998 ◽  
Vol 161-163 ◽  
pp. 59-62
Author(s):  
Katsutoshi Komeya ◽  
Takeshi Meguro ◽  
Y. Chiba ◽  
Hua Long Li ◽  
Toshihiro Kameda ◽  
...  
Keyword(s):  
Silicon Nitride ◽  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Transient Liquid Phase Sintering
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