Prediction of Abnormal Etching Profile at High-Aspect-Ratio Via/ Hole Etching by using On-wafer Monitoring System

2009 ◽  
Author(s):  
H. Ohtake ◽  
S. Fukuda ◽  
B. Jinnai ◽  
T. Tatsumi ◽  
T. Samukawa
Keyword(s):  
Aspect Ratio ◽  
Monitoring System ◽  
High Aspect Ratio ◽  
Etching Profile ◽  
Via Hole

Prediction of Abnormal Etching Profile in High-Aspect-Ratio Via/Hole Etching Using On-Wafer Monitoring System

2010 ◽  
Vol 49 (4) ◽  
pp. 04DB14 ◽  
Author(s):  
Hiroto Ohtake ◽  
Seiichi Fukuda ◽  
Butsurin Jinnai ◽  
Tomohiko Tatsumi ◽  
Seiji Samukawa
Keyword(s):  
Aspect Ratio ◽  
Monitoring System ◽  
High Aspect Ratio ◽  
Etching Profile ◽  
Via Hole

UV excimer laser drilled high aspect ratio submicron via hole

2009 ◽  
Vol 256 (1) ◽  
pp. 183-186 ◽  
Author(s):  
K.H. Chen ◽  
Wenhsing Wu ◽  
Byung Hwan Chu ◽  
C.Y. Chang ◽  
Jenshan Lin ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Excimer Laser ◽  
High Aspect Ratio ◽  
Via Hole

Simulating the chlorine plasma etching profile of high-aspect-ratio trenches in Si

2017 ◽  
Vol 46 (5) ◽  
pp. 301-308
Author(s):  
A. S. Shumilov ◽  
I. I. Amirov ◽  
V. F. Luckichev
Keyword(s):  
Aspect Ratio ◽  
Plasma Etching ◽  
High Aspect Ratio ◽  
Etching Profile

A high aspect ratio via hole dry etching technology for high power GaAs MESFET

2003 ◽  
Author(s):  
K. Sumitani ◽  
M. Komaru ◽  
M. Kobiki ◽  
Y. Higaki ◽  
Y. Mitsui ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Power ◽  
High Aspect Ratio ◽  
Dry Etching ◽  
Gaas Mesfet ◽  
Via Hole
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