scholarly journals Die Placement Performance Evaluation on Different Machine Platforms

2021 ◽  
pp. 41-45
Author(s):  
Rennier Rodriguez ◽  
Edwin Graycochea Jr. ◽  
Frederick Ray Gomez
Keyword(s):  
Performance Evaluation ◽  
Critical Design ◽  
Machine Selection ◽  
Die Attach ◽  
Graph Comparison ◽  
Critical Requirement ◽  
Two Machines

The paper focuses on the die placement tolerance capability with critical design for land grid array (LGA) device evaluated on two different die attach machine platforms. The evaluation was narrowed down into two main die attach machines with the objective of attaining the best performance in terms of die placement tolerance capability. Die placement tolerance were quantified and only die attach Machine B was able to satisfy the specification of less than 30 microns. The study used a bar graph comparison in terms of die placement tolerance on the two machines and presented the effect of machine selection on die placement tolerance capability. For future works, the selected die attach machine could be used for devices with critical requirement.

scholarly journals Study of Diebond Machine Platform on Theta Rotation Performance

2021 ◽  
pp. 45-49
Author(s):  
Edwin M. Graycochea Jr. ◽  
Rennier S. Rodriguez ◽  
Frederick Ray I. Gomez
Keyword(s):  
Comparison Analysis ◽  
Critical Design ◽  
Machine Selection ◽  
Critical Machine ◽  
Critical Requirement ◽  
Two Machines

Theta rotation on die during diebond process is one of the critical machine responses especially for land grid array (LGA) device with tight tolerances requirement. The paper focuses on the die theta rotation tolerance capability with critical design for LGA device evaluated on two different diebond machine platforms. The evaluation was narrowed down into two main diebond machines with the objective of attaining the best performance in terms of die theta rotation tolerance capability. The study used a side-by-side comparison analysis in terms of theta rotation on the two machines and presented the effect of machine selection on the theta rotation response. Theta rotation was monitored and both machines satisfied the specification of 1 degree of maximum rotation, though diebond Machine 1 was able to produce a more stable diebonding with only around less than 0.15 degree of theta rotation variation. For future works, the selected diebond machine could be used for devices with critical requirement.

scholarly journals Die Attach Machine Selection for Glue Voids Reduction Performance

2020 ◽  
pp. 1-5
Author(s):  
Edwin Graycochea Jr. ◽  
Rennier Rodriguez ◽  
Frederick Ray Gomez ◽  
Bryan Christian Bacquian
Keyword(s):  
Analysis Of Variance ◽  
Machine Selection ◽  
Die Attach ◽  
Selection For ◽  
Critical Requirement ◽  
Two Machines

The paper is focused on the glue voids reduction of quad-flat no-leads (QFN) devices evaluated on different die attach machine platforms. The evaluation was narrowed-down into two main die attach machines with the objective of attaining the best performance in terms of reducing or eliminating the glue voids. Glue voids were quantified and only die attach Machine B was able to satisfy the specification. The study used analysis of variance on the two machines and presented the effect of machine selection on glue voids reduction. For future works, the selected die attach machine could be used for devices with critical requirement.

scholarly journals A Study of Die Shear Test Performance on Different Diebond Machine Platforms

2020 ◽  
pp. 19-23
Author(s):  
B. C. Bacquian ◽  
R. Rodriguez ◽  
N. Gomez ◽  
E. Graycochea Jr. ◽  
F. R. Gomez
Keyword(s):  
Adhesion Strength ◽  
Test Performance ◽  
Shear Test ◽  
Single Row ◽  
Die Attach ◽  
Performance Capability ◽  
Critical Requirement ◽  
Statistical Results

The paper focused on the evaluation of quad-flat no-leads single-row (QFN-sr) leadframe package for die shear test performance on different diebond machine platforms. Die shear test determines the adhesion strength on the interface between the silicon die and the die attach glue to the diepad of the leadframe device. Moreover, the test is critically monitored as failed response may lead to die lift or delamination. Statistical results showed the two diebond machines achieving die shear test performance above the specification, with Machine Y having significant improvement over its counterpart. Future works could utilize any of the two diebond machines platforms as far as die shear test performance is concerned. For devices with critical requirement, Machine Y is recommended for its higher die shear test performance capability.

scholarly journals Package Reliability Performance Study of QFN Device on Different Die Attach Machines

2020 ◽  
pp. 41-43
Author(s):  
Edwin Graycochea Jr. ◽  
Rennier Rodriguez ◽  
Frederick Ray Gomez ◽  
Bryan Christian Bacquian
Keyword(s):  
Thermal Cycling ◽  
Thermal Cycle ◽  
Performance Study ◽  
Die Attach ◽  
Significant Difference ◽  
Quality And Reliability ◽  
The Difference ◽  
Reliability Performance ◽  
Two Machines ◽  
Package Reliability

The paper is focused on the reliability performance of quad-flat no-leads (QFN) package evaluated on different die attach machine platforms. Reliability tests were done to check the difference in the quality and reliability performance of the device that undergone die attach process on two different machines. Thermal cycling resulted in significant difference on the two machines, with the device processed in Machine 1 showing reliability failures while on Machine 2 it passed the 1000 thermal cycle. For future works, Machine 2 could be used for devices with critical package reliability requirement.

Performance Evaluation of Hybrid Production Lines with Multiple Stochastic Failure Modes and Unreliable Limited Buffers

2011 ◽  
Vol 58-60 ◽  
pp. 410-416 ◽  
Author(s):  
Jun Liu ◽  
Zhi Yuan Rui ◽  
Rui Cheng Feng ◽  
Chun Li Lei
Keyword(s):  
Performance Evaluation ◽  
Manufacturing System ◽  
Failure Modes ◽  
Solution Technique ◽  
Production Lines ◽  
Hybrid Production ◽  
System A ◽  
Limited Buffers ◽  
Stochastic Events ◽  
Two Machines

A hybrid manufacturing system which consists of two machines is examined. Unreliable buffers and multiple stochastic failure modes of the machines are introduced to the system. A new method of the system performance evaluation is presented. The states of the system are analyzed in detail based on a discrete model and a new solution technique is given to determine the state probabilities. The method can be used to analyze the cases arising from two or more stochastic events or longer (or more complex)production lines. Numerical results are also offered to testify the method and show some characteristics of the system.

Fine Particle Mass Monitoring with Low-Cost Sensors: Corrections and Long-Term Performance Evaluation

2019 ◽  
Author(s):  
Carl Malings ◽  
Rebecca Tanzer ◽  
Aliaksei Hauryliuk ◽  
Provat K. Saha ◽  
Allen L. Robinson ◽  
...  
Keyword(s):  
Performance Evaluation ◽  
Fine Particle ◽  
Low Cost ◽  
Particle Mass ◽  
Long Term Performance ◽  
Term Performance
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